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Technical Specifications
Parameters and characteristics for this part
| Specification | 24-3518-11H |
|---|---|
| Contact Finish - Mating | Gold |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Mating | 10 çin |
| Contact Finish Thickness - Mating | 0.25 çm |
| Contact Finish Thickness - Post | 10 çin |
| Contact Finish Thickness - Post | 0.25 çm |
| Contact Material - Mating | Beryllium Copper |
| Contact Material - Post [custom] | Brass |
| Current Rating (Amps) | 3 A |
| Features | Open Frame |
| Housing Material | Glass Filled, Polyamide (PA46), Nylon 4/6 |
| Material Flammability Rating | UL94 V-0 |
| Mounting Type | Through Hole |
| Number of Positions or Pins (Grid) | 24 |
| Pitch - Mating | 0.1 in |
| Pitch - Mating | 2.54 mm |
| Pitch - Post | 2.54 mm |
| Pitch - Post | 0.1 in |
| Termination | Solder |
| Termination Post Length | 3.18 mm |
| Termination Post Length | 0.125 in |
| Type | 0.3 " |
| Type | 7.62 mm |
| Type | DIP |
| Part | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Mounting Type | Features | Type | Type | Type | Material Flammability Rating | Contact Material - Post [custom] | Termination Post Length | Termination Post Length | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Termination | Housing Material | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 10 çin | 0.25 çm | Gold | Through Hole | Open Frame | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Brass | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | Gold | 0.1 in | 2.54 mm | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 24 | 3 A |
Aries Electronics | Beryllium Copper | 200 µin | 5.08 µm | Gold | Through Hole | Open Frame | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Brass | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | Tin | 0.1 in | 2.54 mm | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 24 | 3 A |
Aries Electronics | Beryllium Copper | 200 µin | 5.08 µm | Gold | Surface Mount | Open Frame | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Brass | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | Tin | 0.1 in | 2.54 mm | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 24 | 3 A |
 Aries Electronics | Beryllium Copper | 200 µin | 5.08 µm | Gold | Through Hole | Open Frame | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Brass | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | Tin | 0.1 in | 2.54 mm | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 24 | 3 A |
Aries Electronics | Beryllium Copper | 10 çin | 0.25 çm | Gold | Through Hole | Open Frame | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Brass | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | Gold | 0.1 in | 2.54 mm | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 24 | 3 A |
 Aries Electronics | Beryllium Copper | 10 çin | 0.25 çm | Gold | Through Hole | Open Frame | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Brass | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | Gold | 0.1 in | 2.54 mm | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 24 | 3 A |
Aries Electronics | Beryllium Copper | 200 µin | 5.08 µm | Gold | Through Hole | Open Frame | 0.3 " | 7.62 mm | DIP | UL94 V-0 | Brass | 3.18 mm | 0.125 in | 10 çin | 0.25 çm | Tin | 0.1 in | 2.54 mm | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 24 | 3 A |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 58 | $ 6.55 | |
Description
General part information
24-3518 Series
24 (2 x 12) Pos DIP, 0.3" (7.62mm) Row Spacing Socket Gold Through Hole
Documents
Technical documentation and resources