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Power Supplies - Board Mount

LMZ35003RKGT

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Texas Instruments

7V TO 50V, 2.5A STEP-DOWN POWER MODULE IN 9X11X2.8MM QFN PACKAGE

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VSON (DRC)
Power Supplies - Board Mount

LMZ35003RKGT

Active
Texas Instruments

7V TO 50V, 2.5A STEP-DOWN POWER MODULE IN 9X11X2.8MM QFN PACKAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationLMZ35003RKGT
ApplicationsITE (Commercial)
Control FeaturesActive High, Enable
Current - Output (Max) [Max]2.5 A
Efficiency93 %
FeaturesOTP, UVLO, OCP
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case41-BQFN Module
Size / Dimension [x]0.43 "
Size / Dimension [x]11 mm
Size / Dimension [y]9 mm
Size / Dimension [y]0.35 "
Size / Dimension [z]0.11 in
Size / Dimension [z]2.8 mm
Supplier Device Package41-B1QFN (11x9)
TypeNon-Isolated PoL Module
Voltage - Input (Max) [Max]50 V
Voltage - Input (Min) [Min]7 V
Voltage - Output 1 [Max]15 V
Voltage - Output 1 [Min]2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 15.39
5$ 15.27
10$ 15.16
25$ 14.92
50$ 14.46
100$ 13.06
Digi-Reel® 1$ 15.39
5$ 15.27
10$ 15.16
25$ 14.92
50$ 14.46
100$ 13.06
Tape & Reel (TR) 250$ 12.83
500$ 12.59
Texas InstrumentsSMALL T&R 1$ 15.33
100$ 13.39
250$ 10.32
1000$ 9.23

Description

General part information

LMZ35003 Series

The LMZ35003 power module is an easy-to-use integrated power solution that combines a 2.5-A DC/DC converter with a shielded inductor and passives into a low profile, QFN package. This total power solution allows as few as five external components and eliminates the loop compensation and magnetics part selection process.

The small 9 mm × 11 mm × 2.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation capability. The LMZ35003 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ35003 power module is an easy-to-use integrated power solution that combines a 2.5-A DC/DC converter with a shielded inductor and passives into a low profile, QFN package. This total power solution allows as few as five external components and eliminates the loop compensation and magnetics part selection process.