LMZ35003 Series

7V to 50V, 2.5A Step-Down Power Module in 9x11x2.8mm QFN Package

Catalog

7V to 50V, 2.5A Step-Down Power Module in 9x11x2.8mm QFN Package

Part	Utilized IC / Part	Contents	Regulator Topology	Main Purpose	Board Type	Supplied Contents	Current - Output	Voltage - Output	Outputs and Type	Outputs and Type	Voltage - Input [Min]	Voltage - Input [Max]	Features	Efficiency	Applications	Voltage - Input (Min) [Min]	Type	Operating Temperature [Max]	Operating Temperature [Min]	Supplier Device Package	Number of Outputs	Voltage - Input (Max) [Max]	Mounting Type	Voltage - Output 1 [Min]	Voltage - Output 1 [Max]	Current - Output (Max) [Max]	Size / Dimension [y]	Size / Dimension [z]	Size / Dimension [z]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [x]	Control Features	Package / Case
Texas Instruments LMZ35003EVM-001	LMZ35003	Board(s)	Buck	DC/DC Step Down	Fully Populated	Board(s)	2.5 A	2.5 V 3.3 V 5 V 12 V 15 VDC	1 Non-Isolated Output Non-Isolated	1	7 V	50 V
Texas Instruments LMZ35003RKGT													OCP OTP UVLO	93 %	ITE (Commercial)	7 V	Non-Isolated PoL Module	85 °C	-40 °C	41-B1QFN (11x9)	1	50 V	Surface Mount	2.5 V	15 V	2.5 A	9 mm	0.11 in	2.8 mm	0.43 "	0.35 "	11 mm	Active High Enable	41-BQFN Module
Texas Instruments LMZ35003RKGR													OCP OTP UVLO	93 %	ITE (Commercial)	7 V	Non-Isolated PoL Module	85 °C	-40 °C	41-B1QFN (11x9)	1	50 V	Surface Mount	2.5 V	15 V	2.5 A	9.2 mm	0.11 in	2.9 mm	0.44 "	0.36 "	11.2 mm	Active High Enable	41-BQFN Module

Catalog

7V to 50V, 2.5A Step-Down Power Module in 9x11x2.8mm QFN Package

Key Features

• Complete Integrated Power Solution AllowsSmall Footprint, Low-Profile DesignWide Input Voltage Range from 7 V to 50 VOutput Adjustable from 2.5 V to 15 V65-V Surge CapabilityEfficiencies Up To 96%Adjustable Switching Frequency(300 kHz to 1 MHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing and TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionPre-bias Output Start-upOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 14°C/WMeets EN55022 Class B Emissions- Integrated Shielded InductorFor Design Help visithttp://www.ti.com/LMZ35003Create a Custom Design Using the LMZ35003 With theWEBENCH®Power DesignerComplete Integrated Power Solution AllowsSmall Footprint, Low-Profile DesignWide Input Voltage Range from 7 V to 50 VOutput Adjustable from 2.5 V to 15 V65-V Surge CapabilityEfficiencies Up To 96%Adjustable Switching Frequency(300 kHz to 1 MHz)Synchronizes to an External ClockAdjustable Slow-StartOutput Voltage Sequencing and TrackingPower Good OutputProgrammable Undervoltage Lockout (UVLO)Output Overcurrent ProtectionOver Temperature ProtectionPre-bias Output Start-upOperating Temperature Range: –40°C to 85°CEnhanced Thermal Performance: 14°C/WMeets EN55022 Class B Emissions- Integrated Shielded InductorFor Design Help visithttp://www.ti.com/LMZ35003Create a Custom Design Using the LMZ35003 With theWEBENCH®Power Designer

Description

The LMZ35003 power module is an easy-to-use integrated power solution that combines a 2.5-A DC/DC converter with a shielded inductor and passives into a low profile, QFN package. This total power solution allows as few as five external components and eliminates the loop compensation and magnetics part selection process. The small 9 mm × 11 mm × 2.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation capability. The LMZ35003 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques. The LMZ35003 power module is an easy-to-use integrated power solution that combines a 2.5-A DC/DC converter with a shielded inductor and passives into a low profile, QFN package. This total power solution allows as few as five external components and eliminates the loop compensation and magnetics part selection process. The small 9 mm × 11 mm × 2.8 mm, QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation capability. The LMZ35003 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering a wide range of ICs and systems. Advanced packaging technology affords a robust and reliable power solution compatible with standard QFN mounting and testing techniques.