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RQ3E120ATTB
Discrete Semiconductor Products

RQ3E075ATTB

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Rohm Semiconductor

PCH -30V -18A MIDDLE POWER MOSFET

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RQ3E120ATTB
Discrete Semiconductor Products

RQ3E075ATTB

Active
Rohm Semiconductor

PCH -30V -18A MIDDLE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ3E075ATTB
Current - Continuous Drain (Id) @ 25°C18 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs10.4 nC
Input Capacitance (Ciss) (Max) @ Vds930 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)15 W
Rds On (Max) @ Id, Vgs [Max]23 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.42
10$ 1.06
100$ 0.75
500$ 0.60
1000$ 0.55
Digi-Reel® 1$ 1.42
10$ 1.06
100$ 0.75
500$ 0.60
1000$ 0.55
N/A 2228$ 1.45
Tape & Reel (TR) 3000$ 0.48
6000$ 0.45
9000$ 0.44

Description

General part information

RQ3E075AT Series

RQ3E075AT is high power small mold package(HSMT8) MOSFET for switching application.

Documents

Technical documentation and resources

HSMT8 TB Taping Spec

Datasheet

Transistor, MOSFET Flammability

Related Document

HSMT8 Part Marking

Related Document

What Is Thermal Design

Thermal Design

P-channel Power MOSFETs selection guide

Technical Article

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

RQ3E075AT Data Sheet

Data Sheet

HSMT8 Single Cu Inner Structure

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

About Export Regulations

Export Information

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

List of Transistor Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

ESD Data

Characteristics Data

Compliance of the RoHS directive

Environmental Data

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Package Dimensions

Package Information

How to Create Symbols for PSpice Models

Models

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification