Integrated Circuits (ICs)

W66CP2NQUAGJ

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Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

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Integrated Circuits (ICs)

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Winbond Electronics

IC DRAM 4GBIT LVSTL 11 200WFBGA

Technical Specifications

Parameters and characteristics for this part

Part	Clock Frequency	Package / Case	Memory Format	Memory Size	Memory Type	Operating Temperature [Max]	Operating Temperature [Min]	Technology	Write Cycle Time - Word, Page	Voltage - Supply [Min]	Voltage - Supply [Max]	Memory Organization	Mounting Type	Supplier Device Package
Winbond Electronics W66CP2NQUAGJ TR	2.133 GHz	200-WFBGA	DRAM	512 kb	Volatile	105 °C	-40 °C	SDRAM - Mobile LPDDR4	18 ns	1.06 V 1.7 V	1.17 V 1.95 V	128 M	Surface Mount	200-WFBGA (10x14.5)
Winbond Electronics W66CP2NQUAHJ	2.133 GHz	200-WFBGA	DRAM	512 kb	Volatile	105 °C	-40 °C	SDRAM - Mobile LPDDR4	18 ns	1.06 V 1.7 V	1.17 V 1.95 V	128 M	Surface Mount	200-WFBGA (10x14.5)
Winbond Electronics W66CP2NQUAFJ TR	2.133 GHz	200-WFBGA	DRAM	512 kb	Volatile	105 °C	-40 °C	SDRAM - Mobile LPDDR4	18 ns	1.06 V 1.7 V	1.17 V 1.95 V	128 M	Surface Mount	200-WFBGA (10x14.5)
Winbond Electronics W66CP2NQUAGJ	2.133 GHz	200-WFBGA	DRAM	512 kb	Volatile	105 °C	-40 °C	SDRAM - Mobile LPDDR4	18 ns	1.06 V 1.7 V	1.17 V 1.95 V	128 M	Surface Mount	200-WFBGA (10x14.5)

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Tray	144	$ 5.28

General part information

SDRAM - Mobile LPDDR4 Memory IC 4Gbit LVSTL_11 2.133 GHz 3.5 ns 200-WFBGA (10x14.5)

Technical documentation and resources