W66CP2 Series
Manufacturer: Winbond Electronics
IC DRAM 4GBIT LVSTL 11 200WFBGA
| Part | Technology | Memory Type | Memory Format | Memory Size | Clock Frequency | Write Cycle Time - Word, Page | Access Time | Supplier Device Package | Operating Temperature [Min] | Operating Temperature [Max] | Package / Case | Memory Organization | Mounting Type | Memory Interface | Voltage - Supply [Min] | Voltage - Supply [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 512 kB | 2.133 GHz | 18 ns | 3.5 ns | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 200-WFBGA | 128 M | Surface Mount | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 512 kB | 2.133 GHz | 18 ns | 3.5 ns | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 200-WFBGA | 128 M | Surface Mount | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 512 kB | 2.133 GHz | 18 ns | 3.5 ns | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 200-WFBGA | 128 M | Surface Mount | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 512 kB | 2.133 GHz | 18 ns | 3.5 ns | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 200-WFBGA | 128 M | Surface Mount | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 512 kB | 2.133 GHz | 3.5 ns | 200-WFBGA (10x14.5) | -40 °C | 105 °C | 200-WFBGA | 128 M | Surface Mount | LVSTL_11 | 1.06 V 1.7 V | 1.17 V 1.95 V |