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TO-3PFM
Discrete Semiconductor Products

RGTV80TK65GVC11

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Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 23A, TO-3PFM, FIELD STOP TRENCH IGBT

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TO-3PFM
Discrete Semiconductor Products

RGTV80TK65GVC11

Active
Rohm Semiconductor

2ΜS SHORT-CIRCUIT TOLERANCE, 650V 23A, TO-3PFM, FIELD STOP TRENCH IGBT

Technical Specifications

Parameters and characteristics for this part

SpecificationRGTV80TK65GVC11
Current - Collector (Ic) (Max) [Max]39 A
Gate Charge81 nC
IGBT TypeTrench Field Stop
Mounting TypeThrough Hole
Operating Temperature [Max]175 °C
Operating Temperature [Min]-40 C
Package / CaseTO-3PFM, SC-93-3
Power - Max [Max]85 W
Supplier Device PackageTO-3PFM
Switching Energy710 µJ, 1.02 mJ
Td (on/off) @ 25°C113 ns, 39 ns
Test Condition10 Ohm, 40 A, 400 V, 15 V
Vce(on) (Max) @ Vge, Ic1.9 V
Voltage - Collector Emitter Breakdown (Max)650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 3.64
30$ 1.99
120$ 1.62
NewarkEach 1$ 3.76
10$ 3.46
25$ 3.15
50$ 3.14
100$ 3.13
250$ 3.02
900$ 2.89

Description

General part information

RGTV80TK65 Series

RGTV80TK65 is a IGBT with low collector - emitter saturation voltage, suitable for PFC, Solar Inverter, UPS, Welding, IH applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Notes for Temperature Measurement Using Thermocouples

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Package Dimensions

Package Information

Types and Features of Transistors

Application Note

Semikron Danfoss: Partnering for the Safe Supply of Industrial Power Modules

White Paper

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

Anti-Whisker formation

Package Information

Compliance of the ELV directive

Environmental Data

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Moisture Sensitivity Level

Package Information

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

About Flammability of Materials

Environmental Data

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

About Export Administration Regulations (EAR)

Export Information

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Generation Mechanism of Voltage Surge on Commutation Side (Basic)

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design