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TO-220 / 2
Discrete Semiconductor Products

MSC030SDA120K

Active
Microchip Technology

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 1.2 KV, 30 A, 130 NC, TO-220

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TO-220 / 2
Discrete Semiconductor Products

MSC030SDA120K

Active
Microchip Technology

SILICON CARBIDE SCHOTTKY DIODE, SINGLE, 1.2 KV, 30 A, 130 NC, TO-220

Technical Specifications

Parameters and characteristics for this part

SpecificationMSC030SDA120K
Capacitance @ Vr, F141 pF
Current - Average Rectified (Io)70 A
Current - Reverse Leakage @ Vr200 µA
Mounting TypeThrough Hole
Operating Temperature - Junction [Max]175 ░C
Operating Temperature - Junction [Min]-55 C
Package / CaseTO-220-2
Reverse Recovery Time (trr)0 ns
SpeedNo Recovery Time
Supplier Device PackageTO-220-2
TechnologySiC (Silicon Carbide) Schottky
Voltage - DC Reverse (Vr) (Max) [Max]1.2 kV
Voltage - Forward (Vf) (Max) @ If1.8 V

MSC030SDA170B-Diode Series

1200V Silicon Carbide (SiC) Schottky Barrier Diodes (SBDs)

PartReverse Recovery Time (trr)Mounting TypeVoltage - Forward (Vf) (Max) @ IfSpeedCurrent - Reverse Leakage @ VrTechnologyOperating Temperature - Junction [Max]Operating Temperature - Junction [Min]Voltage - DC Reverse (Vr) (Max) [Max]Package / CaseCapacitance @ Vr, FSupplier Device PackageCurrent - Average Rectified (Io)
TO-247 / 2
Microchip Technology
0 ns
Through Hole
1.8 V
No Recovery Time
200 µA
SiC (Silicon Carbide) Schottky
175 ░C
-55 C
700 V
TO-247-2
1200 pF
TO-247
60 A
D3PAK
Microchip Technology
0 ns
Surface Mount
No Recovery Time
SiC (Silicon Carbide) Schottky
1.2 kV
D3PAK (2 Leads + Tab)
TO-268-3
TO-268AA
D3PAK
30 A
TO-220 / 2
Microchip Technology
0 ns
Through Hole
1.8 V
No Recovery Time
200 µA
SiC (Silicon Carbide) Schottky
175 ░C
-55 C
1.2 kV
TO-220-2
141 pF
TO-220-2
70 A
TO-247-3
Microchip Technology
0 ns
Through Hole
1.8 V
No Recovery Time
200 µA
SiC (Silicon Carbide) Schottky
175 ░C
-55 C
1.2 kV
TO-247-3
141 pF
TO-247-3
65 A
D3PAK
Microchip Technology
0 ns
Surface Mount
1.8 V
No Recovery Time
200 µA
SiC (Silicon Carbide) Schottky
175 ░C
-55 C
700 V
D3PAK (2 Leads + Tab)
TO-268-3
TO-268AA
D3PAK
60 A
TO-247 / 2
Microchip Technology
0 ns
Through Hole
1.5 V
No Recovery Time
SiC (Silicon Carbide) Schottky
1.2 kV
TO-247-2
TO-247
30 A
TO-220 / 2
Microchip Technology
0 ns
Through Hole
1.5 V
No Recovery Time
SiC (Silicon Carbide) Schottky
700 V
TO-220-2
TO-220-2
30 A
INFINEON IDYH80G200C5XKSA1
Microchip Technology
0 ns
Through Hole
1.8 V
No Recovery Time
200 µA
SiC (Silicon Carbide) Schottky
175 ░C
-55 C
1700 V
TO-247-2
2070 pF
TO-247
82 A
INFINEON IDYH80G200C5XKSA1
Microchip Technology
0 ns
Through Hole
1.8 V
No Recovery Time
200 µA
SiC (Silicon Carbide) Schottky
175 ░C
-55 C
700 V
TO-247-3
1200 pF
TO-247-3
60 A

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 100$ 8.51
Microchip DirectTUBE 1$ 10.33
10$ 9.53
100$ 8.29
500$ 7.74
NewarkEach 1$ 10.74
10$ 10.33
25$ 9.91
50$ 9.27
100$ 8.62

Description

General part information

MSC030SDA170B-Diode Series

Our mSiC Diodes are engineered to deliver superior performance and efficiency. Silicon Carbide (SiC) Schottky Barrier Diodes (SBD) offer a lower forward voltage drop, higher switching speeds and reduced power losses. This enables improved efficiency, reduced thermal requirements and enhanced reliability.

This 1700V mSiC diode offers significant advantages in diverse applications with a forward current rating of up to 30A ensures robust performance in high-power applications. The reverse leakage current is minimized to 4 µA, providing excellent efficiency and reliability. This dual SiC diode with a common cathode configuration offers superior efficiency and reliability, ideal for high-voltage and high-frequency power conversion applications.

mSiC diodes in a TO-247 2-lead package deliver exceptional performance for high-power and high-frequency applications. The TO-247 package is designed for optimal thermal management, with a large surface area that ensures efficient heat dissipation, enabling reliable operation under heavy loads. This package accommodates high current and voltage ratings, making it ideal for demanding applications. SiC diodes' inherent benefits are further enhanced by the rugged and straightforward design of the TO-247 package, offering engineers a versatile and efficient solution for high-performance power systems.