Specification	24-354W00-20

Contact Finish - Mating	Gold
Contact Finish - Post	Tin-Lead
Contact Finish Thickness - Mating	0.25 µm
Contact Finish Thickness - Mating	10 µin
Contact Finish Thickness - Post	200 µin
Contact Finish Thickness - Post	5.08 µm
Contact Material - Mating	Beryllium Copper
Contact Material - Post [custom]	Brass
Convert From (Adapter End)	DIP
Convert From (Adapter End) [custom]	0.3 in
Convert From (Adapter End) [custom]	7.62 mm
Convert To (Adapter End)	SOWIC
Current Rating (Amps)	3 A
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability Rating	UL94 V-0
Mounting Type	Through Hole
Number of Pins	24
Operating Temperature	105 C
Pitch - Mating	0.1 "
Pitch - Mating	2.54 mm
Pitch - Post	0.05 in
Pitch - Post	1.27 mm
Termination	Solder

354W00 Series

Part	Contact Material - Post [custom]	Material Flammability Rating	Contact Material - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Operating Temperature	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Mounting Type	Termination	Convert To (Adapter End)	Convert From (Adapter End) [custom]	Convert From (Adapter End) [custom]	Convert From (Adapter End)	Pitch - Post	Pitch - Post	Housing Material	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Number of Pins	Contact Finish - Post
Aries Electronics 14-354W00-10	Brass	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	105 C	200 µin	5.08 µm	3 A	Through Hole	Solder	SOWIC	0.3 in	7.62 mm	DIP	0.05 in	1.27 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	14	Tin-Lead
Aries Electronics 24-354W00-20	Brass	UL94 V-0	Beryllium Copper	0.25 µm	10 µin	105 C	200 µin	5.08 µm	3 A	Through Hole	Solder	SOWIC	0.3 in	7.62 mm	DIP	0.05 in	1.27 mm	Polyamide (PA46) Nylon 4/6 Glass Filled	Gold	0.1 "	2.54 mm	24	Tin-Lead

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly