Part	Mounting Type	Operating Temperature [Max]	Operating Temperature [Min]	Frequency	Serial Interfaces	Memory Size	Protocol	Package / Case	RF Family/Standard	Current - Receiving	Type	GPIO	Voltage - Supply [Min]	Voltage - Supply [Max]	Power - Output	Supplier Device Package	Current - Transmitting	Current - Transmitting [Max]	Current - Transmitting [Min]	Antenna Type	Supplied Contents	For Use With/Related Products
Microchip Technology ATSAMB11G18A-MU-T	Surface Mount	85 °C	-40 °C	2.4 GHz	I2C SPI UART	128 kB 128 kB 256 kB	Bluetooth v4.1	48-VFQFN Exposed Pad	Bluetooth	4.2 mA	TxRx + MCU	30	2.3 V	4.3 V	3.5 dBm	48-QFN (6x6)	3 mA
Microchip Technology ATSAMB11G18A-MU-Y	Surface Mount	85 °C	-40 °C	2.4 GHz	I2C SPI UART	128 kB 128 kB 256 kB	Bluetooth v4.1	48-VFQFN Exposed Pad	Bluetooth	4.2 mA	TxRx + MCU	30	2.3 V	4.3 V	3.5 dBm	48-QFN (6x6)		4 mA	3 mA
Microchip Technology ATSAMB11-MR210CA	Surface Mount			2.4 GHz	I2C SPI UART	128 kB 128 kB 256 kB	Bluetooth v4.1	Module	Bluetooth	4 mA			2.3 V	3.6 V	4 dBm		3 mA			Integrated Chip
Microchip Technology ATSAMB11-XPRO				2.4 GHz							Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)										Board(s)	SAM B11
Microchip Technology ATSAMB11ZR-XPRO				2.4 GHz							Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)										Board(s)	ATSAMB11-ZR210CA
Microchip Technology ATSAMB11-XR2100A	Surface Mount			2.4 GHz	I2C SPI UART		Bluetooth v4.1	Module	Bluetooth	4 mA			2.3 V	3.6 V	4 dBm		3 mA			Integrated Chip

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Description

General part information

BLE4.1 SoC with fully embedded stack (link and host layer, including ATT/GATT/GAP) in ROM (128KB)

Cortex M0-based MCU with 128KB RAM and 256KB Flash (stacked die with SPI interface)

Onboard ADC (11b) and PWM generator and general purpose timers

Technical documentation and resources