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YEP-8-BGA Pkg
Integrated Circuits (ICs)

SN74LVC2G241YEPR

Obsolete
Texas Instruments

IC BUF NON-INVERT 5.5V 8DSBGA

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YEP-8-BGA Pkg
Integrated Circuits (ICs)

SN74LVC2G241YEPR

Obsolete
Texas Instruments

IC BUF NON-INVERT 5.5V 8DSBGA

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74LVC2G241YEPR
Current - Output High, Low [x]32 mA
Current - Output High, Low [y]32 mA
Logic TypeBuffer, Non-Inverting
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Output Type3-State
Package / Case8-XFBGA, DSBGA
Supplier Device Package8-DSBGA (1.9x0.9)
Supplier Device Package [x]1.9
Supplier Device Package [y]0.9
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]1.65 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$

Description

General part information

SN74LVC2G241 Series

This dual buffer and line driver is designed for 1.65-V to 5.5-V VCCoperation.

The SN74LVC2G241 device is designed specifically to improve both the performance and density of 3-state memory-address drivers, clock drivers, and bus-oriented receivers and transmitters.

NanoFree package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources

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