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AM1707BZKBA3
Integrated Circuits (ICs)

OMAPL137CZKB3

Obsolete
Texas Instruments

IC MPU OMAP-L1X 375MHZ 256BGA

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AM1707BZKBA3
Integrated Circuits (ICs)

OMAPL137CZKB3

Obsolete
Texas Instruments

IC MPU OMAP-L1X 375MHZ 256BGA

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationOMAPL137CZKB3
Additional InterfacesSPI, MMC/SD, UART, I2C, HPI, McASP
Co-Processors/DSPSignal Processing, System Control, C674x, CP15
Core ProcessorARM926EJ-S
Display & Interface ControllersLCD
Ethernet1
Ethernet [Max]100 Mbps
Ethernet [Min]10 Mbps
Graphics AccelerationFalse
Mounting TypeSurface Mount
Number of Cores/Bus Width32 Bit, 1 Core
Operating Temperature [Max]90 °C
Operating Temperature [Min]0 °C
Package / Case256-BGA
Speed375 MHz
Supplier Device Package256-BGA (17x17)
USBUSB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O3.3 V, 1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

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Description

General part information

OMAPL137-HT Series

The OMAP-L137 device is a low-power applications processor based on an ARM926EJ-S and a TMS320C674x DSP core. It consumes significantly lower power than other members of the TMS320C6000 platform of DSPs.

The OMAP-L137 device enables original-equipment manufacturers (OEMs) and original-design manufacturers (ODMs) to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the OMAP-L137 device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

Documents

Technical documentation and resources

No documents available