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Discrete Semiconductor Products

RF4E110BNTR

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Rohm Semiconductor

MOSFET N-CH 30V 11A HUML2020L8

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Product schematic image
Discrete Semiconductor Products

RF4E110BNTR

Active
Rohm Semiconductor

MOSFET N-CH 30V 11A HUML2020L8

Technical Specifications

Parameters and characteristics for this part

SpecificationRF4E110BNTR
Current - Continuous Drain (Id) @ 25°C11 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]24 nC
Input Capacitance (Ciss) (Max) @ Vds1200 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerUDFN
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs11.1 mOhm
Supplier Device PackageHUML2020L8
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.07
10$ 0.67
100$ 0.44
500$ 0.34
1000$ 0.31
Digi-Reel® 1$ 0.66
10$ 0.57
100$ 0.40
500$ 0.33
1000$ 0.28
N/A 648$ 1.06
Tape & Reel (TR) 3000$ 0.22

Description

General part information

RF4E110 Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

How to Use LTspice® Models

Schematic Design & Verification

How to Create Symbols for PSpice Models

Models

Compliance of the RoHS directive

Environmental Data

RF4E110BN Data Sheet

Data Sheet

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

What Is Thermal Design

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Explanation for Marking

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Taping Information

Package Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

About Export Regulations

Export Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Condition of Soldering / Land Pattern Reference

Package Information

Part Explanation

Application Note

Inner Structure

Package Information

Method for Monitoring Switching Waveform

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Certificate of not containing SVHC under REACH Regulation

Environmental Data

Notes for Temperature Measurement Using Thermocouples

Thermal Design

ESD Data

Characteristics Data

Types and Features of Transistors

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design