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Discrete Semiconductor Products

RF4E110BNTR

Active
Rohm Semiconductor

MOSFET N-CH 30V 11A HUML2020L8

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Product thumbnail image
Discrete Semiconductor Products

RF4E110BNTR

Active
Rohm Semiconductor

MOSFET N-CH 30V 11A HUML2020L8

Technical Specifications

Parameters and characteristics for this part

SpecificationRF4E110BNTR
Current - Continuous Drain (Id) @ 25°C11 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]24 nC
Input Capacitance (Ciss) (Max) @ Vds1200 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerUDFN
Power Dissipation (Max) [Max]2 W
Rds On (Max) @ Id, Vgs [Max]11.1 mOhm
Supplier Device PackageHUML2020L8
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.07
10$ 0.67
100$ 0.44
500$ 0.34
1000$ 0.31
Digi-Reel® 1$ 0.66
10$ 0.57
100$ 0.40
500$ 0.33
1000$ 0.28
Tape & Reel (TR) 3000$ 0.22

Description

General part information

RF4E110GN Series

Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications. Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

Documents

Technical documentation and resources

What is a Thermal Model? (Transistor)

Thermal Design

How to Create Symbols for PSpice Models

Models

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Taping Information

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Two-Resistor Model for Thermal Simulation

Thermal Design

Types and Features of Transistors

Application Note

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

Inner Structure

Package Information

Part Explanation

Application Note

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

ESD Data

Characteristics Data

List of Transistor Package Thermal Resistance

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Package Dimensions

Package Information

About Flammability of Materials

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Explanation for Marking

Package Information

Moisture Sensitivity Level - Transistors

Package Information

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

RF4E110BN Data Sheet

Data Sheet

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Condition of Soldering / Land Pattern Reference

Package Information