Specification	10027747-11110TLF

Card Thickness	1.57 mm
Card Thickness	0.062 in
Card Type	PCI Express™
Color	Black
Contact Finish	Gold
Contact Finish Thickness	0.38 µm
Contact Finish Thickness	15 µin
Contact Material	Copper Alloy
Contact Type	Cantilever
Features	Board Lock
Gender	Female
Material - Insulation	Nylon, Glass Filled, Polyamide (PA)
Mounting Type	Through Hole
Number of Positions	280
Number of Positions/Bay/Row [custom]	11
Number of Positions/Bay/Row [custom]	65
Number of Positions/Bay/Row [custom]	64
Number of Rows [custom]	2
Operating Temperature [Max]	85 °C
Operating Temperature [Min]	-55 C
Pitch	1 mm
Pitch	0.039 in
Read Out	Dual
Termination	Solder

10027747 Series

Part	Material - Insulation	Contact Finish	Features	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Number of Positions/Bay/Row [custom]	Card Type	Read Out	Operating Temperature [Min]	Operating Temperature [Max]	Gender	Card Thickness	Card Thickness	Contact Material	Contact Finish Thickness	Number of Rows [custom]	Termination	Pitch	Pitch	Mounting Type	Contact Type	Number of Positions	Color	Contact Finish Thickness	Contact Finish Thickness
Amphenol ICC (FCI) 10027747-11210TLF	Glass Filled Nylon Polyamide (PA)	Gold	Board Lock	11	65	64	PCI Express™	Dual	-55 C	85 °C	Female	1.57 mm	0.062 in	Copper Alloy	Flash	2	Solder	1 mm	0.039 in	Through Hole	Cantilever	280	Black
Amphenol ICC (FCI) 10027747-11110TLF	Glass Filled Nylon Polyamide (PA)	Gold	Board Lock	11	65	64	PCI Express™	Dual	-55 C	85 °C	Female	1.57 mm	0.062 in	Copper Alloy		2	Solder	1 mm	0.039 in	Through Hole	Cantilever	280	Black	0.38 µm	15 µin
Amphenol ICC (FCI) 10027747-11010TLF	Glass Filled Nylon Polyamide (PA)	Gold	Board Lock	11	65	64	PCI Express™	Dual	-55 C	85 °C	Female	1.57 mm	0.062 in	Copper Alloy		2	Solder	1 mm	0.039 in	Through Hole	Cantilever	280	Black	0.76 Ám	30 Áin

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	N/A	0	$ 0.00