10027747 Series
Manufacturer: Amphenol ICC (FCI)
Beta
⌘K
CONN PCI EXP FMALE 280POS 0.039
| Part | Material - Insulation | Contact Finish | Features | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Card Type | Read Out | Operating Temperature [Min] | Operating Temperature [Max] | Gender | Card Thickness | Card Thickness | Contact Material | Contact Finish Thickness | Number of Rows [custom] | Termination | Pitch | Pitch | Mounting Type | Contact Type | Number of Positions | Color | Contact Finish Thickness | Contact Finish Thickness |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | Gold | Board Lock | 11 | 65 | 64 | PCI Express™ | Dual | -55 C | 85 °C | Female | 1.57 mm | 0.062 in | Copper Alloy | Flash | 2 | Solder | 1 mm | 0.039 in | Through Hole | Cantilever | 280 | Black | ||
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | Gold | Board Lock | 11 | 65 | 64 | PCI Express™ | Dual | -55 C | 85 °C | Female | 1.57 mm | 0.062 in | Copper Alloy | 2 | Solder | 1 mm | 0.039 in | Through Hole | Cantilever | 280 | Black | 0.38 µm | 15 µin | |
Amphenol ICC (FCI) | Glass Filled Nylon Polyamide (PA) | Gold | Board Lock | 11 | 65 | 64 | PCI Express™ | Dual | -55 C | 85 °C | Female | 1.57 mm | 0.062 in | Copper Alloy | 2 | Solder | 1 mm | 0.039 in | Through Hole | Cantilever | 280 | Black | 0.76 Ám | 30 Áin |