
CSD95420RCBT
Active50-A PEAK CONTINUOUS SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE
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CSD95420RCBT
Active50-A PEAK CONTINUOUS SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE
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Technical Specifications
Parameters and characteristics for this part
| Specification | CSD95420RCBT |
|---|---|
| Applications | Synchronous Buck Converters |
| Current - Output / Channel | 25 A |
| Current - Peak Output | 50 A |
| Fault Protection | Shoot-Through |
| Features | Bootstrap Circuit |
| Interface | PWM |
| Load Type | Capacitive, Inductive |
| Mounting Type | Surface Mount |
| Operating Temperature [Max] | 125 ¯C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 27-PowerTFQFN |
| Supplier Device Package | 27-QFN (4x5) |
| Technology | Power MOSFET |
| Voltage - Load [Max] | 14.5 V |
| Voltage - Load [Min] | 4.5 V |
| Voltage - Supply [Max] | 5.5 V |
| Voltage - Supply [Min] | 4.5 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Bulk | 1 | $ 4.17 | |
| 100 | $ 3.40 | |||
| 1000 | $ 2.83 | |||
| Texas Instruments | SMALL T&R | 1 | $ 4.17 | |
| 100 | $ 3.40 | |||
| 250 | $ 2.67 | |||
| 1000 | $ 2.27 | |||
Description
General part information
CSD95420RCB Series
The CSD95420RCBNexFET™ power stage is highly optimized for high-power, high-density synchronous buck converters. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4 mm × 5 mm outline package. The device integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplifies the completion of the overall system design.
The CSD95420RCBNexFET™ power stage is highly optimized for high-power, high-density synchronous buck converters. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4 mm × 5 mm outline package. The device integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplifies the completion of the overall system design.
Documents
Technical documentation and resources