
CSD95420RCB Series
50-A peak continuous synchronous buck NexFET™ smart power stage
Manufacturer: Texas Instruments
Catalog
50-A peak continuous synchronous buck NexFET™ smart power stage
Key Features
• 50-A peak continuous currentOver 94% system efficiency at 15-AHigh-frequency operation (up to 1.75 MHz)Diode emulation functionTemperature compensated bi-directional current senseAnalog temperature outputFault monitoring3.3-V and 5-V PWM signal compatibleTri-state PWM inputIntegrated bootstrap switchOptimized deadtime for shoot-through protectionQFN packageHigh-density4 mm × 5 mmUltra-low-inductanceSystem-optimized PCB footprintThermally enhanced toolingRoHS compliantLead-free terminal platingHalogen Free50-A peak continuous currentOver 94% system efficiency at 15-AHigh-frequency operation (up to 1.75 MHz)Diode emulation functionTemperature compensated bi-directional current senseAnalog temperature outputFault monitoring3.3-V and 5-V PWM signal compatibleTri-state PWM inputIntegrated bootstrap switchOptimized deadtime for shoot-through protectionQFN packageHigh-density4 mm × 5 mmUltra-low-inductanceSystem-optimized PCB footprintThermally enhanced toolingRoHS compliantLead-free terminal platingHalogen Free
Description
AI
The CSD95420RCBNexFET™ power stage is highly optimized for high-power, high-density synchronous buck converters. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4 mm × 5 mm outline package. The device integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplifies the completion of the overall system design.
The CSD95420RCBNexFET™ power stage is highly optimized for high-power, high-density synchronous buck converters. This product integrates the driver device and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 4 mm × 5 mm outline package. The device integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. The optimized PCB footprint helps reduce design time and simplifies the completion of the overall system design.