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18-8400-610C
Connectors, Interconnects

18-8400-610C

Active
Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

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18-8400-610C
Connectors, Interconnects

18-8400-610C

Active
Aries Electronics

CONN IC DIP SOCKET 18POS GOLD

Deep-Dive with AI

DocumentsDatasheet

Technical Specifications

Parameters and characteristics for this part

Specification18-8400-610C
Contact Finish - MatingGold
Contact Finish - PostGold
Contact Finish Thickness - Mating0.76 Ám
Contact Finish Thickness - Mating30 Áin
Contact Finish Thickness - Post10 Áin
Contact Finish Thickness - Post0.25 çm
Contact Material - MatingBeryllium Copper
Contact Material - Post [custom]Brass
Current Rating (Amps)3 A
FeaturesElevated, Closed Frame
Housing MaterialPolyamide (PA46), Nylon 4/6, Glass Filled
Material Flammability RatingUL94 V-0
Mounting TypeThrough Hole
Number of Positions or Pins (Grid)18
Operating Temperature [Max]105 ░C
Operating Temperature [Min]-55 C
Pitch - Mating0.1 "
Pitch - Mating2.54 mm
Pitch - Post0.1 in
Pitch - Post2.54 mm
TerminationSolder
Termination Post Length3.56 mm
Termination Post Length0.14 in
TypeDIP
Type [custom]15.24 mm
Type [custom]0.6 in
PartMaterial Flammability RatingCurrent Rating (Amps)Termination Post LengthTermination Post LengthContact Finish Thickness - PostContact Finish Thickness - PostContact Finish - PostHousing MaterialContact Material - MatingOperating Temperature [Min]Operating Temperature [Max]TerminationFeaturesNumber of Positions or Pins (Grid)Type [custom]Type [custom]TypeContact Finish Thickness - MatingContact Finish Thickness - MatingMounting TypeContact Finish - MatingPitch - PostPitch - PostPitch - MatingPitch - MatingContact Material - Post [custom]TypeType
18-8400-610C
Aries Electronics
UL94 V-0
3 A
3.56 mm
0.14 in
10 Áin
0.25 çm
Gold
Polyamide (PA46)
Nylon 4/6
Glass Filled
Beryllium Copper
-55 C
105 ░C
Solder
Closed Frame
Elevated
18
15.24 mm
0.6 in
DIP
0.76 Ám
30 Áin
Through Hole
Gold
0.1 in
2.54 mm
0.1 "
2.54 mm
Brass
18-8400-310C
Aries Electronics
UL94 V-0
3 A
3.56 mm
0.14 in
10 Áin
0.25 çm
Gold
Polyamide (PA46)
Nylon 4/6
Glass Filled
Beryllium Copper
-55 C
105 ░C
Solder
Closed Frame
Elevated
18
DIP
0.76 Ám
30 Áin
Through Hole
Gold
0.1 in
2.54 mm
0.1 "
2.54 mm
Brass
7.62 mm
0.3 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 40$ 11.65
N/A 0$ 12.27

Description

General part information

18-8400 Series

18 (2 x 9) Pos DIP, 0.6" (15.24mm) Row Spacing Socket Gold Through Hole

Documents

Technical documentation and resources