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VQFN-CLIP (RRB)
Integrated Circuits (ICs)

CSD95410RRBT

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Texas Instruments

90-A PEAK CONTINUOUS SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE

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VQFN-CLIP (RRB)
Integrated Circuits (ICs)

CSD95410RRBT

Active
Texas Instruments

90-A PEAK CONTINUOUS SYNCHRONOUS BUCK NEXFET™ SMART POWER STAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationCSD95410RRBT
ApplicationsVoltage Regulators, Synchronous Buck Converters
Current - Peak Output80 A
Fault ProtectionShoot-Through
FeaturesBootstrap Circuit, Diode Emulation
Load TypeInductive
Mounting TypeSurface Mount
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Package / Case41-PowerTFQFN
Supplier Device Package41-VQFN-CLIP
TechnologyPower MOSFET

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 6.19
10$ 5.50
25$ 5.25
50$ 5.06
100$ 4.88
Digi-Reel® 1$ 6.19
10$ 5.50
25$ 5.25
50$ 5.06
100$ 4.88
Tape & Reel (TR) 250$ 4.81
500$ 4.51
750$ 4.44
1250$ 4.32
Texas InstrumentsSMALL T&R 1$ 5.34
100$ 4.36
250$ 3.42
1000$ 2.90

Description

General part information

CSD95410RRB Series

The CSD95410NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD95410NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm outline package. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.