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Isolators

BM61M22BFJ-CE2

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Rohm Semiconductor

ISOLATION VOLTAGE 2500VRMS 1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

Product dimension image
Isolators

BM61M22BFJ-CE2

Active
Rohm Semiconductor

ISOLATION VOLTAGE 2500VRMS 1CH GATE DRIVER PROVIDING GALVANIC ISOLATION

Technical Specifications

Parameters and characteristics for this part

SpecificationBM61M22BFJ-CE2
Approval AgencyUL
Common Mode Transient Immunity (Min) [Min]100 V/ns
Current - Output High, Low [custom]2 A
Current - Output High, Low [custom]2 A
Mounting TypeSurface Mount
Number of Channels2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case0.154 in
Package / Case8-SOIC
Package / Case3.9 mm
Propagation Delay tpLH / tpHL (Max) [custom]60 ns
Propagation Delay tpLH / tpHL (Max) [custom]60 ns
Pulse Width Distortion (Max) [Max]60 ns
Rise / Fall Time (Typ) [custom]15 ns
Rise / Fall Time (Typ) [custom]15 ns
Supplier Device Package8-SOP-J
TechnologyCapacitive Coupling
Voltage - Isolation2500 Vrms
Voltage - Output Supply [Max]24 V
Voltage - Output Supply [Min]9 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 4.88
10$ 3.25
25$ 2.82
100$ 2.35
250$ 2.12
500$ 1.98
1000$ 1.86
Digi-Reel® 1$ 4.88
10$ 3.25
25$ 2.82
100$ 2.35
250$ 2.12
500$ 1.98
1000$ 1.86
N/A 1953$ 3.40
Tape & Reel (TR) 2500$ 1.74
5000$ 1.67
NewarkEach (Supplied on Cut Tape) 1$ 4.96
10$ 3.22
25$ 2.77
50$ 2.52
100$ 2.26
250$ 2.01
500$ 1.85
1000$ 1.74

Description

General part information

BM61M22BFJ-C Series

BM61M22BFJ-C is a gate driver providing galvanic isolation with an isolation voltage of 2500Vrms, maximum I/O delay time of 60ns, and minimum input pulse width of 60ns. It incorporates the Under-voltage Lockout (UVLO) function.

Documents

Technical documentation and resources

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Judgment Criteria of Thermal Evaluation

Thermal Design

BM61M22BFJ-C Data Sheet

Data Sheet

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

What Is Thermal Design

Thermal Design

SOP-JW8 Package Information

Package Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Thermal Resistance

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

User's Guide for BM61M22BFJ-EVK001 Evaluation Board (1ch type)

User's Guide

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use the Two-Resistor Model

Thermal Design

Factory Information

Manufacturing Data

User's Guide for BM61M22BFJ-EVK002 Evaluation Board (2ch type)

User's Guide

Technical Data Sheet EN

Datasheet