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FCCSP (CBP)
Integrated Circuits (ICs)

DM3730CBPD100

Active
Texas Instruments

IC DGTL MEDIA PROCESSOR 515FCBGA

FCCSP (CBP)
Integrated Circuits (ICs)

DM3730CBPD100

Active
Texas Instruments

IC DGTL MEDIA PROCESSOR 515FCBGA

Technical Specifications

Parameters and characteristics for this part

SpecificationDM3730CBPD100
InterfaceI2C, USB, USB OTG, 1-Wire®, EBI/EMI, McBSP, UART, MMC/SD, McSPI
Mounting TypeSurface Mount
Non-Volatile Memory32 kB
On-Chip RAM384 kB
Operating Temperature [Max]90 °C
Operating Temperature [Min]-40 °C
Package / CaseFCBGA, 515-WFBGA
Supplier Device Package515-POP-FCBGA (12x12)
TypeDigital Media System-on-Chip (DMSoC)
Voltage - Core1.1 V
Voltage - I/O1.8 V

DM3730 Series

Digital Media Processor

PartMounting TypePackage / CaseOperating Temperature [Min]Operating Temperature [Max]Supplier Device PackageInterfaceVoltage - CoreNon-Volatile MemoryVoltage - I/OOn-Chip RAMTypeOperating Temperature [custom]Clock Rate
FCCSP (CBP)
Texas Instruments
Surface Mount
515-WFBGA
FCBGA
-40 °C
90 °C
515-POP-FCBGA (12x12)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
FCCSP (CUS)
Texas Instruments
Surface Mount
423-LFBGA
FCBGA
423-FCBGA (16x16)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
-40 °C
105 °C
800 MHz
515-POP-FCBGA-CBB
Texas Instruments
Surface Mount
515-WFBGA
FCBGA
0 °C
90 °C
515-POP-FCBGA (12x12)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
800 MHz
DM3725CBP
Texas Instruments
Surface Mount
515-WFBGA
FCBGA
515-POP-FCBGA (12x12)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
-40 °C
105 °C
800 MHz
FCCSP (CBP)
Texas Instruments
Surface Mount
515-WFBGA
FCBGA
0 °C
90 °C
515-POP-FCBGA (12x12)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
FCCSP (CBC)
Texas Instruments
Surface Mount
515-VFBGA
FCBGA
-40 °C
90 °C
515-POP-FCBGA (14x14)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
515-FCBGA-CBC
Texas Instruments
Surface Mount
515-VFBGA
FCBGA
515-POP-FCBGA (14x14)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
-40 °C
105 °C
800 MHz
FCCSP (CUS)
Texas Instruments
Surface Mount
423-LFBGA
FCBGA
0 °C
90 °C
423-FCBGA (16x16)
1-Wire®
EBI/EMI
I2C
McBSP
McSPI
MMC/SD
UART
USB
USB OTG
1.1 V
32 kB
1.8 V
384 kB
Digital Media System-on-Chip (DMSoC)
800 MHz

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 51.98
10$ 48.49
25$ 46.46
168$ 42.10
Texas InstrumentsJEDEC TRAY (5+1) 1$ 43.99
100$ 39.10
250$ 32.14
1000$ 28.75

Description

General part information

DM3730 Series

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

Documents

Technical documentation and resources

DM3730, DM3725 Digital Media Processors datasheet (Rev. D)

Data sheet

Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q)

User guide

PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I

Application note

DM37x Design Network Partners

More literature

OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles

Application note

Selecting the right processor: WiLink 8 plug and play platforms

Technical article

AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)

Application note

AM3715/03 Memory Subsystem

Application note

Introduction to TMS320C6000 DSP Optimization

Application note

Spring has sprung. A sale has sprung.

Technical article

Enabling Wi-Fi® and Bluetooth® connectivity on RTOS

Technical article

PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)

Application note

DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F)

Errata

AM37x CUS Routing Guidelines

Application note

AM/DM37x Overview

Application note

Setting up AM37x SDRC Registers

Application note

PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs

Application note

Plastic Ball Grid Array [PBGA] Application Note (Rev. B)

Application note

AM/DM37x Power Estimation Spreadsheet

Application note

TI OMAP4430 POP SMT Design Guideline (Rev. C)

Application note

Flip Chip Ball Grid Array Package Reference Guide (Rev. A)

User guide

DM3730 Product Bulletin

Product overview

PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II

Application note