Zenode.ai Logo
Beta
515-POP-FCBGA-CBB
Integrated Circuits (ICs)

DM3730CBP

Active
Texas Instruments

IC DGTL MEDIA PROCESSOR 515FCBGA

Deep-Dive with AI

Search across all available documentation for this part.

515-POP-FCBGA-CBB
Integrated Circuits (ICs)

DM3730CBP

Active
Texas Instruments

IC DGTL MEDIA PROCESSOR 515FCBGA

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationDM3730CBP
Clock Rate800 MHz
InterfaceI2C, USB, USB OTG, 1-Wire®, EBI/EMI, McBSP, UART, MMC/SD, McSPI
Mounting TypeSurface Mount
Non-Volatile Memory32 kB
On-Chip RAM384 kB
Operating Temperature [Max]90 °C
Operating Temperature [Min]0 °C
Package / CaseFCBGA, 515-WFBGA
Supplier Device Package515-POP-FCBGA (12x12)
TypeDigital Media System-on-Chip (DMSoC)
Voltage - Core1.1 V
Voltage - I/O1.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 28.98
10$ 28.50
Texas InstrumentsJEDEC TRAY (5+1) 1$ 34.89
100$ 31.01
250$ 25.49
1000$ 22.80

Description

General part information

DM3730 Series

The DM37x generation of high-performance, applications processors are based on the enhanced device architecture and are integrated on TI's advanced 45-nm process technology. This architecture is designed to provide best in class ARM and Graphics performance while delivering low power consumption. This balance of performance and power allow the device to support the following example applications:

The device can support numerous HLOS and RTOS solutions including Linux and Windows Embedded CE which are available directly from TI. Additionally, the device is fully backward compatible with previous Cortex™-A8 processors and OMAP™ processors.

This DM3730/25 Digital Media Processor data manual presents the electrical and mechanical specifications for the DM3730/25 Applications Processor. The information contained in this data manual applies to both the commercial and extended temperature versions of the DM3730/25 Digital Media Processor unless otherwise indicated. It consists of the following sections:

Documents

Technical documentation and resources

DM3730 Product Bulletin

Product overview

AM/DM37x Overview

Application note

OMAP3530/25/15/03, DM3730/25, AM3715/03 CBB, CBC and CUS reflow profiles

Application note

Delta for AM/DM37x Technical Reference Manual Version Q to Version R (Rev. Q)

User guide

TI OMAP4430 POP SMT Design Guideline (Rev. C)

Application note

PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs

Application note

Spring has sprung. A sale has sprung.

Technical article

PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors, Part II

Application note

AM3715/03 Memory Subsystem

Application note

Flip Chip Ball Grid Array Package Reference Guide (Rev. A)

User guide

AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)

Application note

DM37x Design Network Partners

More literature

DM3730, DM3725 Digital Media Processors datasheet (Rev. D)

Data sheet

Plastic Ball Grid Array [PBGA] Application Note (Rev. B)

Application note

DM3730, DM3725 Digital Media Processors Silicon Errata (Revs 1.2, 1.1 & 1.0) (Rev. F)

Errata

PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages, Part II (Rev. A)

Application note

AM37x CUS Routing Guidelines

Application note

Enabling Wi-Fi® and Bluetooth® connectivity on RTOS

Technical article

PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors, Part I

Application note

Selecting the right processor: WiLink 8 plug and play platforms

Technical article

AM/DM37x Power Estimation Spreadsheet

Application note

Introduction to TMS320C6000 DSP Optimization

Application note

Setting up AM37x SDRC Registers

Application note