
MOC207R2M
ActiveOPTOCOUPLER, TRANSISTOR OUTPUT, 1 CHANNEL, SOIC, 8 PINS, 60 MA, 2.5 KV, 100 %
Deep-Dive with AI
Search across all available documentation for this part.

MOC207R2M
ActiveOPTOCOUPLER, TRANSISTOR OUTPUT, 1 CHANNEL, SOIC, 8 PINS, 60 MA, 2.5 KV, 100 %
Deep-Dive with AI
Technical Specifications
Parameters and characteristics for this part
| Specification | MOC207R2M |
|---|---|
| Current - DC Forward (If) (Max) [Max] | 60 mA |
| Current - Output / Channel | 150 mA |
| Current Transfer Ratio (Max) | 200 % |
| Current Transfer Ratio (Min) [Min] | 100 % |
| Input Type | DC |
| Mounting Type | Surface Mount |
| Number of Channels | 1 |
| Operating Temperature [Max] | 100 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 8-SOIC |
| Package / Case [x] | 0.154 in |
| Package / Case [y] | 3.9 mm |
| Rise / Fall Time (Typ) [custom] | 3.2 µs |
| Rise / Fall Time (Typ) [custom] | 4.7 µs |
| Supplier Device Package | 8-SOIC |
| Turn On / Turn Off Time (Typ) | 7.5 µs, 5.7 µs |
| Vce Saturation (Max) [Max] | 400 mV |
| Voltage - Forward (Vf) (Typ) | 1.15 V |
| Voltage - Isolation | 2500 Vrms |
| Voltage - Output (Max) [Max] | 30 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 0.92 | |
| 10 | $ 0.60 | |||
| 100 | $ 0.39 | |||
| 1000 | $ 0.31 | |||
| Digi-Reel® | 1 | $ 0.92 | ||
| 10 | $ 0.60 | |||
| 100 | $ 0.39 | |||
| 1000 | $ 0.31 | |||
| Tape & Reel (TR) | 2500 | $ 0.29 | ||
| 5000 | $ 0.28 | |||
| 12500 | $ 0.27 | |||
| 25000 | $ 0.27 | |||
| Newark | Each | 1 | $ 22.04 | |
| 10 | $ 22.04 | |||
| 25 | $ 22.04 | |||
| ON Semiconductor | N/A | 1 | $ 0.23 | |
Description
General part information
MOC207M Series
These devices consist of a gallium arsenide infrared emitting diode optically coupled to a monolithic silicon phototransistor detector, in a surface mountable, small outline, plastic package. They are ideally suited for high-density applications, and eliminate the need for through-the-board mounting.
Documents
Technical documentation and resources