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Discrete Semiconductor Products

RS7E200BGTB1

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 30V, 390A, DFN5060 ROHS COMPLIANT: YES

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Product thumbnail image
Discrete Semiconductor Products

RS7E200BGTB1

Active
Rohm Semiconductor

MOSFET, N-CHANNEL, 30V, 390A, DFN5060 ROHS COMPLIANT: YES

Technical Specifications

Parameters and characteristics for this part

SpecificationRS7E200BGTB1
Current - Continuous Drain (Id) @ 25°C390 A
Drain to Source Voltage (Vdss)30 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]135 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]9500 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / Case8-PowerTDFN
Power Dissipation (Max)3 W
Power Dissipation (Max)180 W
Rds On (Max) @ Id, Vgs0.67 mOhm
Supplier Device PackageDFN5060-8S
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 2377$ 5.08
NewarkEach (Supplied on Cut Tape) 1$ 4.47
10$ 3.32
25$ 2.95
50$ 2.77
100$ 2.57
250$ 2.36
500$ 2.23
1000$ 2.06

Description

General part information

RS7E200BG Series

RS7E200BG is a power MOSFET with low-on resistance and high power package, suitable for switching, motor drives, and DC/DC converter.

Documents

Technical documentation and resources

Method for Monitoring Switching Waveform

Schematic Design & Verification

Moisture Sensitivity Level - Transistors

Package Information

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Types and Features of Transistors

Application Note

What is a Thermal Model? (Transistor)

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

About Export Regulations

Export Information

Compliance of the RoHS directive

Environmental Data

PCB Layout Thermal Design Guide

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

About Flammability of Materials

Environmental Data

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Part Explanation

Application Note

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Anti-Whisker formation - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

RS7E200BG ESD Data

Characteristics Data

List of Transistor Package Thermal Resistance

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Notes for Calculating Power Consumption:Static Operation

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

RS7E200BG Data Sheet

Data Sheet

How to Use LTspice® Models

Schematic Design & Verification