Discrete Semiconductor Products

2N3743

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Microchip Technology

300 V POWER BJT TO-39 ROHS COMPLIANT: YES

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DocumentsDatasheet Product Change Notice EN

Discrete Semiconductor Products

2N3743

Active

Microchip Technology

300 V POWER BJT TO-39 ROHS COMPLIANT: YES

Deep-Dive with AI

DocumentsDatasheet Product Change Notice EN

Specifications Series Pricing Description Documents

Technical Specifications

Parameters and characteristics for this part

Specification	2N3743

Current - Collector (Ic) (Max) [Max]	200 mA
Current - Collector Cutoff (Max) [Max]	250 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	50 hFE
Mounting Type	Through Hole
Package / Case	TO-39-3 Metal Can, TO-205AD
Power - Max [Max]	1 W
Supplier Device Package	TO-39
Transistor Type	PNP
Vce Saturation (Max) @ Ib, Ic	1.2 V
Voltage - Collector Emitter Breakdown (Max)	300 V

2N3743-Transistor Series

MIL-PRF-19500/397

Part	DC Current Gain (hFE) (Min) @ Ic, Vce [Min]	Vce Saturation (Max) @ Ib, Ic	Supplier Device Package	Package / Case	Power - Max [Max]	Transistor Type	Voltage - Collector Emitter Breakdown (Max)	Current - Collector (Ic) (Max) [Max]	Current - Collector Cutoff (Max) [Max]	Mounting Type
Microchip Technology 2N3743	50 hFE	1.2 V	TO-39	TO-205AD TO-39-3 Metal Can	1 W	PNP	300 V	200 mA	250 nA	Through Hole

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Bulk	100	$ 15.00
Microchip Direct	N/A	1	$ 16.16
Newark	Each	100	$ 15.00
		500	$ 14.43

Description

General part information

2N3743-Transistor Series

This specification covers the performance requirements for PNP, silicon, high-voltage 2N3743, 2N4930 and 2N4931 transistor. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/397. Two levels of product assurance (JANHC and JANKC) for die are provided for each unencapsulated device. The device package outlines are as follows: TO-39 , and surfacemount U4 package for all encapsulated device types. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/397.