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8-SOIC
Integrated Circuits (ICs)

PIC16F15213T-E/SN

Active
Microchip Technology

3.5KB FLASH, 256B RAM, 10B ADC,

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Search across all available documentation for this part.

DocumentsDatasheetPIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications+4
8-SOIC
Integrated Circuits (ICs)

PIC16F15213T-E/SN

Active
Microchip Technology

3.5KB FLASH, 256B RAM, 10B ADC,

Deep-Dive with AI

DocumentsDatasheetPIC16F15213/14/23/24/43/44 Silicon Errata and Data Sheet Clarifications+4

Technical Specifications

Parameters and characteristics for this part

SpecificationPIC16F15213T-E/SN
ConnectivityI2C, LINbus, UART/USART, SPI
Core ProcessorPIC
Core Size8-Bit
Data Converters7, 10 b
Mounting TypeSurface Mount
Number of I/O5
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Oscillator TypeInternal
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Program Memory TypeFLASH
RAM Size256 x 8
Speed32 MHz
Supplier Device Package8-SOIC
Voltage - Supply (Vcc/Vdd) [Max]5.5 V
Voltage - Supply (Vcc/Vdd) [Min]1.8 V

PIC16F15213 Series

PartRAM SizeVoltage - Supply (Vcc/Vdd) [Min]Voltage - Supply (Vcc/Vdd) [Max]Oscillator TypeCore SizeMounting TypeConnectivityData Converters [custom]Data ConvertersSupplier Device PackagePackage / CaseProgram Memory SizeOperating Temperature [Min]Operating Temperature [Max]SpeedNumber of I/OProgram Memory TypeCore ProcessorPackage / CasePackage / CasePackage / Case [y]Package / Case [x]
8-DFN
Microchip Technology
PIC16F15213-E/MF
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Surface Mount
I2C
LINbus
SPI
UART/USART
5/2
10 b
8-DFN (3x3)
8-VDFN Exposed Pad
3.5 KB
-40 °C
125 °C
32 MHz
5
FLASH
PIC
8-PDIP
Microchip Technology
PIC16F15213-I/P
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Through Hole
I2C
LINbus
SPI
UART/USART
5/2
10 b
8-PDIP
8-DIP
3.5 KB
-40 °C
85 °C
32 MHz
5
FLASH
PIC
0.3 in
7.62 mm
MICROCHIP PIC12LF1552-E/P
Microchip Technology
PIC16F15213-E/P
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Through Hole
I2C
LINbus
SPI
UART/USART
5/2
10 b
8-PDIP
8-DIP
3.5 KB
-40 °C
125 °C
32 MHz
5
FLASH
PIC
0.3 in
7.62 mm
DFN / 8
Microchip Technology
PIC16F15213T-I/MF
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Surface Mount
I2C
LINbus
SPI
UART/USART
5/2
10 b
8-DFN (3x3)
8-VDFN Exposed Pad
3.5 KB
-40 °C
85 °C
32 MHz
5
FLASH
PIC
8-SOIC
Microchip Technology
PIC16F15213-I/SN
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Surface Mount
I2C
LINbus
SPI
UART/USART
5/2
10 b
8-SOIC
8-SOIC
3.5 KB
-40 °C
85 °C
32 MHz
5
FLASH
PIC
3.9 mm
0.154 in
8-SOIC
Microchip Technology
PIC16F15213T-E/SN
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Surface Mount
I2C
LINbus
SPI
UART/USART
7
10 b
8-SOIC
8-SOIC
-40 °C
125 °C
32 MHz
5
FLASH
PIC
3.9 mm
0.154 in
MICROCHIP 25AA020AT-I/SN
Microchip Technology
PIC16F15213T-I/SN
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Surface Mount
I2C
LINbus
SPI
UART/USART
5/2
10 b
8-SOIC
8-SOIC
3.5 KB
-40 °C
85 °C
32 MHz
5
FLASH
PIC
3.9 mm
0.154 in
8-SOIC
Microchip Technology
PIC16F15213-E/SN
256 x 8
1.8 V
5.5 V
Internal
8-Bit
Surface Mount
I2C
LINbus
SPI
UART/USART
5/2
10 b
8-SOIC
8-SOIC
3.5 KB
-40 °C
125 °C
32 MHz
5
FLASH
PIC
3.9 mm
0.154 in

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.54
25$ 0.49
100$ 0.46
Digi-Reel® 1$ 0.54
25$ 0.49
100$ 0.46
Tape & Reel (TR) 3300$ 0.46
Microchip DirectT/R 1$ 0.46
25$ 0.42
100$ 0.38
1000$ 0.35
5000$ 0.33

Description

General part information

PIC16F15213 Series

[***Code Examples on GitHub***](https://github.com/orgs/microchip-pic-avr-examples/repositories?q=PIC16F152&type=all&language=&sort=)

The PIC16F152xx 8-bit product family features an essential peripheral set including key Core Independent Peripherals (CIPs), Intelligent Analog, and standard communication modules. Paired with it's ability for eXtreme Low-Power, this family is particularly well-suited for a wide range of low-power applications. Included in the feature set are multiple PWMs, various communication peripherals, an internal temperature sensor, and memory features like a Memory Access Partition (MAP) and Device Information Area (DIA). These product will be offered in a broad selection of packages and pin counts from 8 to 44(40)-pins, to support customers in a variety of applications.