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Discrete Semiconductor Products

BSM300D12P2E001

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Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 300 A, 1.2 KV, MODULE

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Discrete Semiconductor Products

BSM300D12P2E001

Active
Rohm Semiconductor

SILICON CARBIDE MOSFET, HALF BRIDGE, DUAL N CHANNEL, 300 A, 1.2 KV, MODULE

Technical Specifications

Parameters and characteristics for this part

SpecificationBSM300D12P2E001
Configuration2 N-Channel (Half Bridge)
Current - Continuous Drain (Id) @ 25°C300 A
Drain to Source Voltage (Vdss)1200 V
Drain to Source Voltage (Vdss)1.2 kV
Mounting TypeChassis Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / CaseModule
Power - Max [Max]1875 W
Supplier Device PackageModule
TechnologySilicon Carbide (SiC)

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTray 1$ 710.45
NewarkEach 1$ 738.87

Description

General part information

BSM300C12P3E201 Series

BSM300C12P3E201 is a SiC (silicon carbide) power module with Low surge and low switching loss, suitable for motor drive, converter, photovoltaics, wind power generation.

Documents

Technical documentation and resources

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Inner Structure

Package Information

ESD Data

Characteristics Data

How to Create Symbols for PSpice Models

Models

Thermal Resistance Measurement Method for SiC MOSFET

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

About Export Regulations

Export Information

BSM300D12P2E001 Data Sheet

Data Sheet

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

How to measure the oscillation occurs between parallel-connected devices

Technical Article

Compliance of the ELV directive

Environmental Data

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Reliability Test Result

Manufacturing Data

4 Steps for Successful Thermal Designing of Power Devices

White Paper

Optimized heat sink assembly method for effective heat dissipation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Use PLECS Models

Technical Article

Judgment Criteria of Thermal Evaluation

Thermal Design

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What Is Thermal Design

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Simulation Verification to Identify Oscillation between Parallel Dies during Design Phase of Power Modules

Technical Article

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Taping Information

Package Information