Specification	MAXM17575EVKIT#

Board Type	Fully Populated
Contents	Board(s)
Current - Output	1.5 A
Frequency - Switching	900 kHz
Main Purpose	DC/DC, Step Down
Outputs and Type	1
Outputs and Type	Non-Isolated, 1 Non-Isolated Output
Regulator Topology	Buck
Supplied Contents	Board(s)
Utilized IC / Part	MAXM17575
Voltage - Input [Max]	60 V
Voltage - Input [Min]	7.5 V
Voltage - Output	5 V

MAXM17575 Series

Part	Type	Voltage - Input (Min) [Min]	Voltage - Output 1 [Max]	Voltage - Output 1 [Min]	Features	Package / Case	Applications	Operating Temperature [Max]	Operating Temperature [Min]	Mounting Type	Number of Outputs	Size / Dimension [z]	Size / Dimension [z]	Size / Dimension [x]	Size / Dimension [y]	Size / Dimension [y]	Size / Dimension [x]	Supplier Device Package	Current - Output (Max) [Max]	Voltage - Input (Max) [Max]	Supplied Contents	Board Type	Outputs and Type	Outputs and Type	Frequency - Switching	Current - Output	Main Purpose	Utilized IC / Part	Voltage - Input [Max]	Voltage - Input [Min]	Regulator Topology	Contents	Voltage - Output
Analog Devices Inc./Maxim Integrated MAXM17575ALI#T	Non-Isolated PoL Module	4.5 V	12 V	0.9 V	OTP OVP UVLO	28-PowerBLGA Module	ITE (Commercial)	125 °C	-40 C	Surface Mount	1	2.9 mm	0.11 "	0.39 "	0.26 in	6.5 mm	10 mm	28-LGA (6.5x10)	1.5 A	60 V
Analog Devices Inc./Maxim Integrated MAXM17575EVKIT#																					Board(s)	Fully Populated	1	1 Non-Isolated Output Non-Isolated	900 kHz	1.5 A	DC/DC Step Down	MAXM17575	60 V	7.5 V	Buck	Board(s)	5 V
Analog Devices Inc./Maxim Integrated MAXM17575ALI#	Non-Isolated PoL Module	4.5 V	12 V	0.9 V	OTP OVP UVLO	28-PowerBLGA Module	ITE (Commercial)	125 °C	-40 C	Surface Mount	1	2.9 mm	0.11 "	0.39 "	0.26 in	6.5 mm	10 mm	28-LGA (6.5x10)	1.5 A	60 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

Distributor	Package	Quantity	$

Digikey	Box	1	$ 40.91
	N/A	0	$ 42.18
Newark	Each	1	$ 50.64

Description

General part information

MAXM17575 Series

Himalaya uSLIC power modules leverage advanced packaging technology to shrink the power supply solution size by 2.25 times, resulting in micro-sized system-level IC (uSLIC) devices. This is achieved by integrating a synchronous wide-input Himalaya buck converter—which includes built-in FETs, compensation, and additional functions—with an inductor. The combination of these components results in ultra-small power modules that can be used in highly space-constrained systems while complying with the JESD22-B103/B104/B111 mechanical standard. In addition, compliance with the CISPR 22 electromagnetic interference (EMI) standard helps to improve the first-time success rate for EMI certification of your end products.

Documents

Technical documentation and resources

Application Note EN

Datasheet

Technical Data Sheet EN

Datasheet