
STM32L552QEI6
ActiveULTRA-LOW-POWER WITH FPU ARM CORTEX-M33 WITH TRUST ZONE, MCU 110 MHZ WITH 512 KBYTES OF FLASH MEMORY
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STM32L552QEI6
ActiveULTRA-LOW-POWER WITH FPU ARM CORTEX-M33 WITH TRUST ZONE, MCU 110 MHZ WITH 512 KBYTES OF FLASH MEMORY
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Technical Specifications
Parameters and characteristics for this part
| Specification | STM32L552QEI6 |
|---|---|
| Connectivity | SPI, I2C, MMC/SD, LINbus, UART/USART, QSPI, IrDA, CANbus, USB, SAI |
| Core Processor | ARM® Cortex®-M33 |
| Core Size | 32-Bit Single-Core |
| Data Converters | |
| Data Converters [custom] | 12 b |
| Data Converters [custom] | 16 |
| Mounting Type | Surface Mount |
| Number of I/O | 108 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Oscillator Type | Internal |
| Package / Case | 132-UFBGA |
| Peripherals | Brown-out Detect/Reset, WDT, PWM, DMA |
| Program Memory Size | 512 KB |
| Program Memory Type | FLASH |
| RAM Size | 256 K |
| Speed | 110 MHz |
| Supplier Device Package | 132-UFBGA (7x7) |
| Voltage - Supply (Vcc/Vdd) [Max] | 3.6 V |
| Voltage - Supply (Vcc/Vdd) [Min] | 1.71 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 1 | $ 13.51 | |
| 10 | $ 9.57 | |||
| 25 | $ 8.55 | |||
| 80 | $ 7.58 | |||
| 230 | $ 6.92 | |||
| 440 | $ 6.60 | |||
| 945 | $ 6.35 | |||
Description
General part information
NUCLEO-L552ZE-Q Series
The STM32L552xx devices are an ultra-low-power microcontrollers family (STM32L5 Series) based on the high-performance Arm®Cortex®-M33 32-bit RISC core. They operate at a frequency of up to 110 MHz.
The Cortex®-M33 core features a single-precision floating-point unit (FPU), which supports all the Arm®single-precision data-processing instructions and all the data types. The Cortex®-M33 core also implements a full set of DSP (digital signal processing) instructions and a memory protection unit (MPU) which enhances the application’s security.
These devices embed high-speed memories (512 Kbytes of Flash memory and 256 Kbytes of SRAM), a flexible external memory controller (FSMC) for static memories (for devices with packages of 100 pins and more), an Octo-SPI Flash memories interface (available on all packages) and an extensive range of enhanced I/Os and peripherals connected to two APB buses, two AHB buses and a 32-bit multi-AHB bus matrix.
Documents
Technical documentation and resources