Zenode.ai Logo
Beta
BA17818FP-E2
Discrete Semiconductor Products

RD3U080CNTL1

Active
Rohm Semiconductor

MOSFET N-CH 250V 8A TO252

Deep-Dive with AI

Search across all available documentation for this part.

BA17818FP-E2
Discrete Semiconductor Products

RD3U080CNTL1

Active
Rohm Semiconductor

MOSFET N-CH 250V 8A TO252

Technical Specifications

Parameters and characteristics for this part

SpecificationRD3U080CNTL1
Current - Continuous Drain (Id) @ 25°C8 A
Drain to Source Voltage (Vdss)250 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]25 nC
Input Capacitance (Ciss) (Max) @ Vds1440 pF
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-55 °C
Package / CaseSC-63, DPAK (2 Leads + Tab), TO-252-3
Power Dissipation (Max) [Max]85 W
Rds On (Max) @ Id, Vgs300 mOhm
Supplier Device PackageTO-252
TechnologyMOSFET (Metal Oxide)
Vgs (Max)30 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.88
10$ 1.56
100$ 1.24
500$ 1.05
1000$ 0.89
Digi-Reel® 1$ 1.88
10$ 1.56
100$ 1.24
500$ 1.05
1000$ 0.89
Tape & Reel (TR) 2500$ 0.85
5000$ 0.82
12500$ 0.79

Description

General part information

RD3U080CN Series

RD3U080CN is a power MOSFET with low on-resistance and fast switching, suitable for the switching application.

Documents

Technical documentation and resources

Moisture Sensitivity Level - Transistors

Package Information

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

What Is Thermal Design

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

About Flammability of Materials

Environmental Data

Report of SVHC under REACH Regulation

Environmental Data

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Types and Features of Transistors

Application Note

Package Dimensions

Package Information

About Export Regulations

Export Information

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

RD3U080CN ESD Data

Characteristics Data

How to Create Symbols for PSpice Models

Models

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

RD3U080CN Data Sheet

Data Sheet

Part Explanation

Application Note

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

Reliability Test Result

Manufacturing Data