
TSX339IDT
ActiveCOMPARATOR, MICROPOWER, 4 CHANNELS, 2.7 V TO 16 V, ±1.35 V TO ±8 V, 14 PINS, SOIC

TSX339IDT
ActiveCOMPARATOR, MICROPOWER, 4 CHANNELS, 2.7 V TO 16 V, ±1.35 V TO ±8 V, 14 PINS, SOIC
Technical Specifications
Parameters and characteristics for this part
| Specification | TSX339IDT |
|---|---|
| CMRR, PSRR (Typ) | 90 dB, 90 dB |
| Current - Input Bias (Max) [Max] | 10 pA |
| Current - Quiescent (Max) [Max] | 13 µA |
| Mounting Type | Surface Mount |
| Number of Elements | 4 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 C |
| Output Type | Open-Drain |
| Package / Case | 3.9 mm, 0.154 in |
| Package / Case | 14-SOIC |
| Supplier Device Package | 14-SO |
| Type | CMOS |
| Voltage - Input Offset (Max) [Max] | 5 mV |
| Voltage - Supply, Single/Dual (±) [Max] | 16 V |
| Voltage - Supply, Single/Dual (±) [Min] | 2.7 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.84 | |
| 10 | $ 1.65 | |||
| 25 | $ 1.56 | |||
| 100 | $ 1.33 | |||
| 250 | $ 1.25 | |||
| 500 | $ 1.09 | |||
| 1000 | $ 0.90 | |||
| Digi-Reel® | 1 | $ 1.84 | ||
| 10 | $ 1.65 | |||
| 25 | $ 1.56 | |||
| 100 | $ 1.33 | |||
| 250 | $ 1.25 | |||
| 500 | $ 1.09 | |||
| 1000 | $ 0.90 | |||
| N/A | 2350 | $ 2.75 | ||
| Tape & Reel (TR) | 2500 | $ 0.84 | ||
| 5000 | $ 0.81 | |||
| 12500 | $ 0.78 | |||
Description
General part information
TSX339 Series
The TSX339 is a micropower CMOS dual voltage comparator which exhibits a very low current consumption of 5 µA typical per comparator. This device was designed as the improvement of the TS339: it shows a lower current consumption, a better input offset voltage, and an enhanced ESD tolerance. The TSX339 is fully specified over a wide temperature range and is proposed in automotive grade for the TSSOP14 package. It is fully compatible with TS339 CMOS comparator and is available with similar packages. The new tiny package, QFN16 3x3, is also proposed for the TSX339 thus allowing even more integration on applications.
Documents
Technical documentation and resources