Zenode.ai Logo
Beta
14-SOIC
Integrated Circuits (ICs)

TSX339IDT

Active
STMicroelectronics

COMPARATOR, MICROPOWER, 4 CHANNELS, 2.7 V TO 16 V, ±1.35 V TO ±8 V, 14 PINS, SOIC

Deep-Dive with AI

Search across all available documentation for this part.

DocumentsDatasheet+6
14-SOIC
Integrated Circuits (ICs)

TSX339IDT

Active
STMicroelectronics

COMPARATOR, MICROPOWER, 4 CHANNELS, 2.7 V TO 16 V, ±1.35 V TO ±8 V, 14 PINS, SOIC

Deep-Dive with AI

DocumentsDatasheet+6

Technical Specifications

Parameters and characteristics for this part

SpecificationTSX339IDT
CMRR, PSRR (Typ)90 dB, 90 dB
Current - Input Bias (Max) [Max]10 pA
Current - Quiescent (Max) [Max]13 µA
Mounting TypeSurface Mount
Number of Elements4
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Output TypeOpen-Drain
Package / Case3.9 mm, 0.154 in
Package / Case14-SOIC
Supplier Device Package14-SO
TypeCMOS
Voltage - Input Offset (Max) [Max]5 mV
Voltage - Supply, Single/Dual (±) [Max]16 V
Voltage - Supply, Single/Dual (±) [Min]2.7 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 1.84
10$ 1.65
25$ 1.56
100$ 1.33
250$ 1.25
500$ 1.09
1000$ 0.90
Digi-Reel® 1$ 1.84
10$ 1.65
25$ 1.56
100$ 1.33
250$ 1.25
500$ 1.09
1000$ 0.90
N/A 2350$ 2.75
Tape & Reel (TR) 2500$ 0.84
5000$ 0.81
12500$ 0.78

Description

General part information

TSX339 Series

The TSX339 is a micropower CMOS dual voltage comparator which exhibits a very low current consumption of 5 µA typical per comparator. This device was designed as the improvement of the TS339: it shows a lower current consumption, a better input offset voltage, and an enhanced ESD tolerance. The TSX339 is fully specified over a wide temperature range and is proposed in automotive grade for the TSSOP14 package. It is fully compatible with TS339 CMOS comparator and is available with similar packages. The new tiny package, QFN16 3x3, is also proposed for the TSX339 thus allowing even more integration on applications.