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39-BQFN Exposed Pad
Integrated Circuits (ICs)

TPS84210RKGT

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Texas Instruments

3-V TO 6-V INPUT, 2-A SYNCHRONOUS BUCK, INTEGRATED POWER SOLUTION

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39-BQFN Exposed Pad
Integrated Circuits (ICs)

TPS84210RKGT

Active
Texas Instruments

3-V TO 6-V INPUT, 2-A SYNCHRONOUS BUCK, INTEGRATED POWER SOLUTION

Technical Specifications

Parameters and characteristics for this part

SpecificationTPS84210RKGT
Current - Output2 A
Frequency - Switching [Max]2 MHz
Frequency - Switching [Min]500 kHz
FunctionStep-Down
Mounting TypeSurface Mount
Number of Outputs1
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Output ConfigurationPositive
Output TypeAdjustable
Package / Case39-BQFN Exposed Pad
Supplier Device Package39-B1QFN (11x9)
Synchronous RectifierTrue
TopologyBuck
Voltage - Input (Max) [Max]6 V
Voltage - Input (Min) [Min]2.95 V
Voltage - Output (Max) [Max]3.6 V
Voltage - Output (Min/Fixed)0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 8.93
10$ 6.17
25$ 5.45
100$ 4.65
Digi-Reel® 1$ 8.93
10$ 6.17
25$ 5.45
100$ 4.65
Tape & Reel (TR) 250$ 4.26
500$ 4.03
750$ 3.91
1250$ 3.77
1750$ 3.71
Texas InstrumentsSMALL T&R 1$ 6.29
100$ 5.12
250$ 4.03
1000$ 3.42

Description

General part information

TPS84210 Series

The TPS84210RKG is an easy-to-use integrated power solution that combines a 2-A DC/DC converter with power MOSFETs, an inductor, and passives into a low profile, BQFN package. This total power solution requires as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The BQFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 12°C/W junction to ambient. The device delivers the full 2-A rated output current at 85°C ambient temperature without airflow.

The TPS84210 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.