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SSOP / 28
Integrated Circuits (ICs)

PIC32MM0128GPM028-I/SS

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Microchip Technology

32-BIT MICROCONTROLLER 128KBYTE FLASH 16KBYTE SRAM MIPS32 MICROAPTIV UC CORE LOW POWER AND USB 28-PI… MORE

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Search across all available documentation for this part.

DocumentsMPLAB Harmony v3 Project MigrationExtending PIC MCU Capabilities Using CLC+5
SSOP / 28
Integrated Circuits (ICs)

PIC32MM0128GPM028-I/SS

Active
Microchip Technology

32-BIT MICROCONTROLLER 128KBYTE FLASH 16KBYTE SRAM MIPS32 MICROAPTIV UC CORE LOW POWER AND USB 28-PI… MORE

Deep-Dive with AI

DocumentsMPLAB Harmony v3 Project MigrationExtending PIC MCU Capabilities Using CLC+5

Technical Specifications

Parameters and characteristics for this part

SpecificationPIC32MM0128GPM028-I/SS
ConnectivityBrown-out Detect/Reset, I2S, POR, WDT, PWM, DMA, HLVD
Core ProcessorMIPS32® microAptiv™
Core Size32-Bit Single-Core
Data ConvertersA/D 12x10/12b
Mounting TypeSurface Mount
Number of I/O21 I/O
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Oscillator TypeInternal
Package / Case28-SSOP
Package / Case [custom]0.209 in
Package / Case [custom]5.3 mm
Program Memory Size128 KB
Program Memory TypeFLASH
RAM Size16 K
Speed25 MHz
Supplier Device Package28-SSOP
Voltage - Supply (Vcc/Vdd) [Max]3.6 V
Voltage - Supply (Vcc/Vdd) [Min]2 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 2.51
25$ 2.28
100$ 2.08
Microchip DirectTUBE 1$ 2.51
25$ 2.28
100$ 2.08
1000$ 1.91
5000$ 1.83

Description

General part information

PIC32MM0128GPM028 Series

The eXtreme low power PIC32MM GPM family extends Microchip's lowest power and most cost-effective family of 32-bit PIC32 microcontrollers by adding USB and ECC memory up to 128KB. The PIC32MM GPM family provides a smooth upward migration path to the [PIC32MM GPL family](https://www.microchip.com/en-us/product/pic32mm0064gpl036) customers who want more memory and pins while also providing a cost-effective migration path for customers who need higher performance and lower power in compact packages as small as 4x4mm.

**Benefits:**

* eXtreme low power in compact packages