PM4329-FEI
ActiveHDLIU# 32 276 BBGA 27X27X2.65MM TRAY ROHS COMPLIANT: YES
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PM4329-FEI
ActiveHDLIU# 32 276 BBGA 27X27X2.65MM TRAY ROHS COMPLIANT: YES
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Technical Specifications
Parameters and characteristics for this part
| Specification | PM4329-FEI |
|---|---|
| Function | Transceiver |
| Interface | J1, T1, E1 |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Tray | 1 | $ 65.09 | |
| 25 | $ 54.23 | |||
| 100 | $ 52.39 | |||
| Microchip Direct | TRAY | 1 | $ 65.09 | |
| 25 | $ 54.23 | |||
| 100 | $ 49.30 | |||
| Newark | Each | 25 | $ 54.23 | |
| 100 | $ 49.30 | |||
Description
General part information
PM4329 Series
The PM4329 HDLIU-32 features 32 short-haul T1 or E1 LIUs in a single device. The HDLIU-32 delivers unprecedented 32-channel T1/E1/J1 port density and is optimized for multi-service provisioning platforms (MSPPs), add/drop multiplexers (ADMs), wireless infrastructure, multi-service switches and edge routers. Traditional solutions rely on interconnecting the various semiconductor components with clock and data signals. Using the traditional approach to address these higher port count requirements quickly becomes cost prohibitive and requires more complexity for equipment designers as chip pin count and power consumption increase. To address this problem, the HDLIU-32 device supports a low trace count, high-density, industry standard Scalable Bandwidth Interconnect (SBI) bus. In addition, for transport applications, the device supports a variant of this interface referred to as the Scalable Bandwidth Interconnect Transport (SBI TR) bus. This technology enables Microchip to offer the lowest cost T1/E1/J1 mapper/framer/LIU solution in the industry.
The HDLIU-32 has a 7-watt typical power dissipation, provides a -40 to +85c industrial temperature operating range and is packaged in a single 27mm x 27mm L2BGA package.
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