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BA17818FP-E2
Discrete Semiconductor Products

RF301BGE2STL

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Rohm Semiconductor

DIODE GEN PURP 200V 3A TO252

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BA17818FP-E2
Discrete Semiconductor Products

RF301BGE2STL

Active
Rohm Semiconductor

DIODE GEN PURP 200V 3A TO252

Technical Specifications

Parameters and characteristics for this part

SpecificationRF301BGE2STL
Current - Average Rectified (Io)3 A
Current - Reverse Leakage @ Vr10 ÁA
Mounting TypeSurface Mount
Operating Temperature - Junction [Max]150 °C
Package / CaseTO-252-3, SC-63, DPAK (2 Leads + Tab)
Reverse Recovery Time (trr)25 ns
Speed500 ns, 200 mA
Supplier Device PackageTO-252
TechnologyStandard
Voltage - DC Reverse (Vr) (Max) [Max]200 V
Voltage - Forward (Vf) (Max) @ If930 mV

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.81
10$ 0.70
100$ 0.49
500$ 0.41
1000$ 0.35
Digi-Reel® 1$ 0.81
10$ 0.70
100$ 0.49
500$ 0.41
1000$ 0.35
N/A 5000$ 1.02
Tape & Reel (TR) 2500$ 0.27
5000$ 0.27

Description

General part information

RF301 Series

RF301BGE2S is the silicon epitaxial planar type Fast Recovery Diode.

Documents

Technical documentation and resources

Power Loss and Thermal Design of Diodes

Thermal Design

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Absolute Maximum Rating and Electrical Characteristics of Diodes

Technical Article

Moisture Sensitivity Level - Diodes

Package Information

Anti-Whisker formation - Diodes

Package Information

Two-Resistor Model for Thermal Simulation

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

RF301BGE2S Data Sheet

Data Sheet

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

How to Select Rectifier Diodes

Technical Article

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Compliance of the RoHS directive

Environmental Data

Diode Types and Applications

Technical Article

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

About Export Regulations

Export Information

What Is Thermal Design

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification

Judgment Criteria of Thermal Evaluation

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

List of Diode Package Thermal Resistance

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Part Explanation

Application Note

What is a Thermal Model? (Diode)

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

About Flammability of Materials

Environmental Data

Reliability Test Result

Manufacturing Data

Report of SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

RF301BGE2S ESD Data

Characteristics Data

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Method for Monitoring Switching Waveform

Schematic Design & Verification

How to Select Reverse Current Protection Diodes for LDO Regulators

Schematic Design & Verification