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ROHM RQ3G110ATTB
Discrete Semiconductor Products

RQ3G110ATTB

Active
Rohm Semiconductor

POWER MOSFET, P CHANNEL, 40 V, 35 A, 0.0098 OHM, HSMT, SURFACE MOUNT

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ROHM RQ3G110ATTB
Discrete Semiconductor Products

RQ3G110ATTB

Active
Rohm Semiconductor

POWER MOSFET, P CHANNEL, 40 V, 35 A, 0.0098 OHM, HSMT, SURFACE MOUNT

Technical Specifications

Parameters and characteristics for this part

SpecificationRQ3G110ATTB
Current - Continuous Drain (Id) @ 25°C35 A, 11 A
Drain to Source Voltage (Vdss)40 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 4.5 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]46 nC
Input Capacitance (Ciss) (Max) @ Vds [Max]2750 pF
Mounting TypeSurface Mount
Operating Temperature150 °C
Package / Case8-PowerVDFN
Power Dissipation (Max)2 W
Rds On (Max) @ Id, Vgs12.4 mOhm
Supplier Device Package [custom]8-HSMT
Supplier Device Package [x]3.2
Supplier Device Package [y]3
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id2.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 2.34
10$ 1.50
100$ 1.02
500$ 0.82
1000$ 0.75
Digi-Reel® 1$ 2.34
10$ 1.50
100$ 1.02
500$ 0.82
1000$ 0.75
N/A 5815$ 2.27
Tape & Reel (TR) 3000$ 0.65

Description

General part information

RQ3G110AT Series

RQ3G110AT is a power MOSFET, suitable for load switching applications.

Documents

Technical documentation and resources

Technical Data Sheet EN

Datasheet

Method for Monitoring Switching Waveform

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

About Flammability of Materials

Environmental Data

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

RQ3G110AT ESD Data

Characteristics Data

Condition of Soldering / Land Pattern Reference

Package Information

Moisture Sensitivity Level - Transistors

Package Information

HSMT8 Single Cu Inner Structure

Package Information

Explanation for Marking

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

About Export Regulations

Export Information

PCB Layout Thermal Design Guide

Thermal Design

Taping Information

Package Information

Part Explanation

Application Note

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use LTspice® Models

Schematic Design & Verification

P-channel Power MOSFETs selection guide

Technical Article

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

How to Use LTspice® Models: Tips for Improving Convergence

Schematic Design & Verification

Notes for Calculating Power Consumption:Static Operation

Thermal Design

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

Package Dimensions

Package Information

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

What is a Thermal Model? (Transistor)

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Types and Features of Transistors

Application Note

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Two-Resistor Model for Thermal Simulation

Thermal Design

List of Transistor Package Thermal Resistance

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

What Is Thermal Design

Thermal Design

Compliance of the RoHS directive

Environmental Data