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8-TSSOP, 8-MSOP
Integrated Circuits (ICs)

SN74AUP3G06DCUR

Active
Texas Instruments

3-CH, 0.8-V TO 3.6-V LOW POWER INVERTERS WITH OPEN-DRAIN OUTPUTS

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8-TSSOP, 8-MSOP
Integrated Circuits (ICs)

SN74AUP3G06DCUR

Active
Texas Instruments

3-CH, 0.8-V TO 3.6-V LOW POWER INVERTERS WITH OPEN-DRAIN OUTPUTS

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74AUP3G06DCUR
Current - Output High, Low-
Current - Output High, Low4 mA
Current - Quiescent (Max) [Max]500 nA
FeaturesOpen Drain
Input Logic Level - High [Max]2 V
Input Logic Level - High [Min]1.6 V
Logic TypeInverter
Max Propagation Delay @ V, Max CL10.5 ns
Mounting TypeSurface Mount
Number of Circuits3
Number of Inputs3
Operating Temperature [Max]85 °C
Operating Temperature [Min]-40 °C
Package / Case8-VFSOP
Package / Case [y]2.3 mm
Package / Case [y]0.091 in
Voltage - Supply [Max]3.6 V
Voltage - Supply [Min]0.8 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 0.46
10$ 0.40
25$ 0.37
100$ 0.30
250$ 0.28
500$ 0.23
1000$ 0.18
Digi-Reel® 1$ 0.46
10$ 0.40
25$ 0.37
100$ 0.30
250$ 0.28
500$ 0.23
1000$ 0.18
Tape & Reel (TR) 3000$ 0.16
6000$ 0.15
15000$ 0.14
30000$ 0.14
75000$ 0.13
Texas InstrumentsLARGE T&R 1$ 0.26
100$ 0.20
250$ 0.15
1000$ 0.10

Description

General part information

SN74AUP3G06 Series

The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).

The output of SN74AUP3G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.