SN74AUP3G06RSER
Active3 10.5NS@3.3V,30PF 500NA 800MV~3.6V UQFN-8(1.5X1.5) INVERTERS ROHS
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SN74AUP3G06RSER
Active3 10.5NS@3.3V,30PF 500NA 800MV~3.6V UQFN-8(1.5X1.5) INVERTERS ROHS
Technical Specifications
Parameters and characteristics for this part
| Specification | SN74AUP3G06RSER |
|---|---|
| Current - Output High, Low | - |
| Current - Output High, Low | 4 mA |
| Current - Quiescent (Max) [Max] | 500 nA |
| Features | Open Drain |
| Input Logic Level - High [Max] | 2 V |
| Input Logic Level - High [Min] | 1.6 V |
| Logic Type | Inverter |
| Max Propagation Delay @ V, Max CL | 10.5 ns |
| Mounting Type | Surface Mount |
| Number of Circuits | 3 |
| Number of Inputs | 3 |
| Operating Temperature [Max] | 85 °C |
| Operating Temperature [Min] | -40 °C |
| Package / Case | 8-UFQFN |
| Supplier Device Package | 8-UQFN (1.5x1.5) |
| Voltage - Supply [Max] | 3.6 V |
| Voltage - Supply [Min] | 0.8 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
| Distributor | Package | Quantity | $ | |
|---|---|---|---|---|
| Digikey | Cut Tape (CT) | 1 | $ 1.06 | |
| Digi-Reel® | 1 | $ 1.06 | ||
| Tape & Reel (TR) | 5000 | $ 0.43 | ||
| 10000 | $ 0.41 | |||
| 15000 | $ 0.42 | |||
| 25000 | $ 0.40 | |||
| LCSC | Piece | 1 | $ 1.18 | |
| 10 | $ 1.15 | |||
| 30 | $ 1.13 | |||
| 100 | $ 1.11 | |||
| Texas Instruments | LARGE T&R | 1 | $ 0.78 | |
| 100 | $ 0.60 | |||
| 250 | $ 0.44 | |||
| 1000 | $ 0.32 | |||
Description
General part information
SN74AUP3G06 Series
The AUP family is TI’s premier solution to the industry’s low-power needs in battery-powered portable applications. This family ensures a very low static- and dynamic-power consumption across the entire VCCrange of 0.8 V to 3.6 V, resulting in increased battery life (see Figure 1). This product also maintains excellent signal integrity (see the very low undershoot and overshoot characteristics shown in Figure 2).
The output of SN74AUP3G06 is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.
Documents
Technical documentation and resources
