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LMG3526R030RQSR
Discrete Semiconductor Products

LMG3526R030RQSR

Active
Texas Instruments

650-V 30-MΩ GAN FET WITH INTEGRATED DRIVER, PROTECTION AND ZERO-VOLTAGE DETECTION

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LMG3526R030RQSR
Discrete Semiconductor Products

LMG3526R030RQSR

Active
Texas Instruments

650-V 30-MΩ GAN FET WITH INTEGRATED DRIVER, PROTECTION AND ZERO-VOLTAGE DETECTION

Technical Specifications

Parameters and characteristics for this part

SpecificationLMG3526R030RQSR
ConfigurationHalf Bridge Inverter
Current55 A
Mounting TypeWettable Flank, Surface Mount
Package / Case52-VQFN Exposed Pad
TypeMOSFET
Voltage650 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyCut Tape (CT) 1$ 27.68
10$ 25.53
25$ 24.38
100$ 21.80
250$ 20.80
500$ 19.79
Digi-Reel® 1$ 27.68
10$ 25.53
25$ 24.38
100$ 21.80
250$ 20.80
500$ 19.79
Tape & Reel (TR) 2000$ 18.34
Texas InstrumentsSMALL T&R 1$ 16.27
100$ 14.21
250$ 10.96
1000$ 9.80

Description

General part information

LMG3526R030 Series

The LMG352xR030 GaN FET with integrated driver and protection is targeted at switch-mode power converters and enables designers to achieve new levels of power density and efficiency.

The LMG352xR030 integrates a silicon driver that enables switching speed up to 150V/ns. TI’s integrated precision gate bias results in higher switching SOA compared to discrete silicon gate drivers. This integration, combined with TI’s low-inductance package, delivers clean switching and minimal ringing in hard-switching power supply topologies. Adjustable gate drive strength allows control of the slew rate from 20V/ns to 150V/ns, which can be used to actively control EMI and optimize switching performance. The LMG3526R030 includes the zero-voltage detection (ZVD) feature which provides a pulse output from the ZVD pin when zero-voltage switching is realized.The LMG3527R030 includes the zero-current detection (ZCD) feature which provides a pulse output from the ZCD pin when a positive drain-to-source current is detected .

Advanced power management features include digital temperature reporting and fault detection. The temperature of the GaN FET is reported through a variable duty cycle PWM output, which simplifies managing device loading. Faults reported include overcurrent, short-circuit, overtemperature, VDD UVLO, and high-impedance RDRV pin.