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JANTX2N5665
Discrete Semiconductor Products

JANTX2N5665

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Microchip Technology

NPN SILICON POWER SWITCHING 200V TO 300V, 5A

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JANTX2N5665
Discrete Semiconductor Products

JANTX2N5665

Active
Microchip Technology

NPN SILICON POWER SWITCHING 200V TO 300V, 5A

Deep-Dive with AI

Technical Specifications

Parameters and characteristics for this part

SpecificationJANTX2N5665
Current - Collector (Ic) (Max)5 A
Current - Collector Cutoff (Max) [Max]200 nA
DC Current Gain (hFE) (Min) @ Ic, Vce [Min]25 hFE
GradeMilitary
Mounting TypeThrough Hole
Package / CaseTO-66-2, TO-213AA
Power - Max [Max]2.5 W
QualificationMIL-PRF-19500/455
Supplier Device PackageTO-66 (TO-213AA)
Transistor TypeNPN
Vce Saturation (Max) @ Ib, Ic1 V
Voltage - Collector Emitter Breakdown (Max)300 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 100$ 30.46
Microchip DirectN/A 1$ 32.80

Description

General part information

JANTXV2N5665-Transistor Series

This specification covers the performance requirements for NPN, silicon, power, 2N5664, 2N5665, 2N5666 and 2N5667 transistors for use in high-speed power-switching applications. Four levels of product assurance (JAN, JANTX, JANTXV and JANS) are provided for each encapsulated device type as specified in MIL-PRF-19500/455. Two levels of product assurance are provided for each un-encapsulated device type as specified in MIL-PRF-19500/455. Provisions for radiation hardness assurance (RHA) to two radiation levels ("R" and "F") are provided for JANTXV and JANHC product assurance level. Provisions for RHA to eight radiation levels are provided for JANS and JANKC product assurance level. RHA level designators; "M", "D", "P", "L", "R", "F", "G", and "H" are appended to the device prefix to identify devices which have passed RHA requirements. The device package for the encapsulated device types are as follows: TO-66, TO-5 and TO-39, and surface mount version U3. The dimensions and topography for JANHC and JANKC unencapsulated die are as outlined in MIL-PRF-19500/455.

Documents

Technical documentation and resources