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8-SOIC
Discrete Semiconductor Products

TPS1101D

Active
Texas Instruments

SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFET

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8-SOIC
Discrete Semiconductor Products

TPS1101D

Active
Texas Instruments

SINGLE P-CHANNEL ENHANCEMENT-MODE MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationTPS1101D
Current - Continuous Drain (Id) @ 25°C2.3 A
Drain to Source Voltage (Vdss)15 V
Drive Voltage (Max Rds On, Min Rds On)10 V, 2.7 V
FET TypeP-Channel
Gate Charge (Qg) (Max) @ Vgs11.25 nC
Mounting TypeSurface Mount
Operating Temperature [Max]150 °C
Operating Temperature [Min]-40 °C
Package / Case8-SOIC
Package / Case [x]0.154 in
Package / Case [y]3.9 mm
Power Dissipation (Max)791 mW
Rds On (Max) @ Id, Vgs90 mOhm
Supplier Device Package8-SOIC
TechnologyMOSFET (Metal Oxide)
Vgs (Max) [Max]2 V
Vgs (Max) [Min]-15 V
Vgs(th) (Max) @ Id1.5 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 1.81
75$ 1.46
150$ 1.20
525$ 1.08
Texas InstrumentsTUBE 1$ 2.26
100$ 1.86
250$ 1.34
1000$ 1.01

Description

General part information

TPS1101 Series

The TPS1101 is a single, low-rDS(on), P-channel, enhancement-mode MOSFET. The device has been optimized for 3-V or 5-V power distribution in battery-powered systems by means of the Texas Instruments LinBiCMOSTM

process. With a maximum VGS(th)of -1.5 V and an IDSSof only 0.5 uA, the TPS1101 is the ideal high-side switch for low-voltage, portable battery-management systems where maximizing battery life is a primary concern. The low rDS(on)and excellent ac characteristics (rise time 5.5 ns typical) of the TPS1101 make it the logical choice for low-voltage switching applications such as power switches for pulse-width-modulated (PWM) controllers or motor/bridge drivers.

The ultrathin thin shrink small-outline package or TSSOP (PW) version fits in height-restricted places where other P-channel MOSFETs cannot. The size advantage is especially important where board height restrictions do not allow for an small-outline integrated circuit (SOIC) package. Such applications include notebook computers, personal digital assistants (PDAs), cellular telephones, and PCMCIA cards. For existing designs, the D-packaged version has a pinout common with other P-channel MOSFETs in SOIC packages.