Zenode.ai Logo
Beta
Product thumbnail image
Isolators

BM60055FV-CE2

Active
Rohm Semiconductor

1CH GATE DRIVER PROVIDING GALVANIC ISOLATION 2500VRMS ISOLATION VOLTAGE

Deep-Dive with AI

Search across all available documentation for this part.

Product thumbnail image
Isolators

BM60055FV-CE2

Active
Rohm Semiconductor

1CH GATE DRIVER PROVIDING GALVANIC ISOLATION 2500VRMS ISOLATION VOLTAGE

Technical Specifications

Parameters and characteristics for this part

SpecificationBM60055FV-CE2
Common Mode Transient Immunity (Min) [Min]100 V/ns
Current - Peak Output5 A
GradeAutomotive
Mounting TypeSurface Mount
Number of Channels [custom]1
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 C
Package / Case28-SSOP
Package / Case [x]0.315 in
Package / Case [y]8 mm
Propagation Delay tpLH / tpHL (Max) [custom]250 ns
Propagation Delay tpLH / tpHL (Max) [custom]250 ns
QualificationAEC-Q100
Rise / Fall Time (Typ)30 ns
Rise / Fall Time (Typ)30 ns
Supplier Device Package28-SSOP
TechnologyMagnetic Coupling
Voltage - Isolation2500 Vrms
Voltage - Output Supply [Max]24 V
Voltage - Output Supply [Min]9 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 0$ 0.00

Description

General part information

BM60055FV-C Series

The BM60055FV-C is a gate driver with an isolation voltage of 2500Vrms, I/O delay time of 250ns, minimum input pulse width of 170ns. It incorporates the fault signal output function (FLT_UVLO, FLT_SC, FLT_OT), under voltage lockout (UVLO) function, short circuit protection (SCP) function, over temperature protection (OT) function, over current protection (OC) function, Soft turn off function, 2 level turn off function, active miller clamping function, switching controller function and output state feedback function.For sale of this product, please contact the specifications in our sales office. Currently, we don't sell this on the internet distributors now.

Documents

Technical documentation and resources

Thermal Resistance

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Anti-Whisker formation

Package Information

SSOP-B28W Package Information

Package Information

PCB Layout Thermal Design Guide

Thermal Design

The Problem with Traditional Vaccine Storage Freezers and How ROHM Cutting-edge Power Solutions Can Take them to the Next Level

White Paper

Precautions for Thermal Resistance of Insulation Sheet

Thermal Design

Five Steps for Successful Thermal Design of IC

White Paper

Solder Joint Rate and Thermal Resistance of Exposed Pad

Thermal Design

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

Design Guide and Example of Stencil for Exposed Pad

Thermal Design

BM60055FV-C Data Sheet

Data Sheet

UL94 Flame Classifications of Mold Compound

Environmental Data

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use the Two-Resistor Model

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Cutting-Edge Web Simulation Tool "ROHM Solution Simulator" Capable of Complete Circuit Verification of Power Devices and Driver ICs

White Paper

Compliance with the ELV directive

Environmental Data

Judgment Criteria of Thermal Evaluation

Thermal Design

What Is Thermal Design

Thermal Design

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

Heat Dissipation Effect of Thermal Via in Exposed Pad Type Package

Thermal Design

Factory Information

Manufacturing Data

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

AEC-Q101 Automotive Requirements

Related Document