RF and Wireless

81-01-14309-2000

Active

RFI FINGERSTOCK BECU UNPLAT ADH

Search across all available documentation for this part.

RF and Wireless

Active

RFI FINGERSTOCK BECU UNPLAT ADH

Technical Specifications

Parameters and characteristics for this part

Part	Plating	Width	Width	Height [z]	Height	Operating Temperature [Max]	Operating Temperature [Min]	Type	Length [x]	Length [x]	Material	Attachment Method	Width [y]	Width [y]	Height [z]	Width [x]	Width [x]	Length	Length
Parker Chomerics 81-01-14215-2000	Unplated	0.37 in	9.4 mm	0.13 "	3.3 mm	121 C	-40 C	Fingerstock	457 mm	17.992 in	Beryllium Copper	Non-Conductive Adhesive
Parker Chomerics 81-01-32AS1-2000	Unplated			0.22 in		121 C	-40 C	Fingerstock	457 mm	17.992 in	Beryllium Copper	Non-Conductive Adhesive	0.6 in	15.24 mm	5.59 mm
Parker Chomerics 81-01-14309-2000	Unplated			0.22 in		121 C	-40 C	Fingerstock			Beryllium Copper	Non-Conductive Adhesive			5.59 mm	0.561 "	14.24 mm	400 mm	15.748 in
Parker Chomerics 81-01-14618-2000	Unplated		7.62 mm	2.54 mm		121 C	-40 C	Fingerstock			Beryllium Copper	Non-Conductive Adhesive			2.54 mm	0.3 in		406 mm	15.984 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly