RF and Wireless

81-01-14215-2000

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RFI FINGERSTOCK BECU UNPLAT ADH

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RF and Wireless

Active

RFI FINGERSTOCK BECU UNPLAT ADH

Technical Specifications

Parameters and characteristics for this part

Part	Plating	Width	Width	Height [z]	Height	Operating Temperature [Max]	Operating Temperature [Min]	Type	Length [x]	Length [x]	Material	Attachment Method	Width [y]	Width [y]	Height [z]	Width [x]	Width [x]	Length	Length
Parker Chomerics 81-01-14215-2000	Unplated	0.37 in	9.4 mm	0.13 "	3.3 mm	121 C	-40 C	Fingerstock	457 mm	17.992 in	Beryllium Copper	Non-Conductive Adhesive
Parker Chomerics 81-01-32AS1-2000	Unplated			0.22 in		121 C	-40 C	Fingerstock	457 mm	17.992 in	Beryllium Copper	Non-Conductive Adhesive	0.6 in	15.24 mm	5.59 mm
Parker Chomerics 81-01-14309-2000	Unplated			0.22 in		121 C	-40 C	Fingerstock			Beryllium Copper	Non-Conductive Adhesive			5.59 mm	0.561 "	14.24 mm	400 mm	15.748 in
Parker Chomerics 81-01-14618-2000	Unplated		7.62 mm	2.54 mm		121 C	-40 C	Fingerstock			Beryllium Copper	Non-Conductive Adhesive			2.54 mm	0.3 in		406 mm	15.984 in

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly