Zenode.ai Logo
Beta
VSSOP (DCU)
Integrated Circuits (ICs)

SN74LVC2G79DCURG4

Unknown
Texas Instruments

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

Deep-Dive with AI

Search across all available documentation for this part.

VSSOP (DCU)
Integrated Circuits (ICs)

SN74LVC2G79DCURG4

Unknown
Texas Instruments

DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP

Technical Specifications

Parameters and characteristics for this part

SpecificationSN74LVC2G79DCURG4
Clock Frequency160 MHz
Current - Output High, Low [x]32 mA
Current - Output High, Low [y]32 mA
Current - Quiescent (Iq)5 µA
FunctionStandard
Input Capacitance3.5 pF
Max Propagation Delay @ V, Max CL4.5 ns
Mounting TypeSurface Mount
Number of Bits per Element1
Number of Elements2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-40 °C
Output TypeNon-Inverted
Package / Case8-VFSOP
Package / Case [y]2.3 mm
Package / Case [y]0.091 in
Trigger TypePositive Edge
TypeD-Type
Voltage - Supply [Max]5.5 V
Voltage - Supply [Min]1.65 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTape & Reel (TR) 3000$ 0.30
6000$ 0.28
15000$ 0.27
30000$ 0.26
Texas InstrumentsLARGE T&R 1$ 0.51
100$ 0.39
250$ 0.29
1000$ 0.20

Description

General part information

SN74LVC2G79 Series

This dual positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V VCCoperation.

When data at the data (D) input meets the setup time requirement, the data is transferred to the Q output on the positive-going edge of the clock pulse. Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the D input can be changed without affecting the levels at the outputs.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

Documents

Technical documentation and resources

Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)

Application note

Signal Switch Data Book (Rev. A)

User guide

Selecting the Right Level Translation Solution (Rev. A)

Application note

How to Select Little Logic (Rev. A)

Application note

Simplifying Solid-State Relay Designs With Logic

Application brief

Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)

Application note

Standard Linear & Logic for PCs, Servers & Motherboards

More literature

STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS

More literature

Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices

Application note

Power-Up Behavior of Clocked Devices (Rev. B)

Application note

LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B)

User guide

LVC Characterization Information

Application note

Low-Voltage Logic (LVC) Designer's Guide

Design guide

Input and Output Characteristics of Digital Integrated Circuits

Application note

Implications of Slow or Floating CMOS Inputs (Rev. E)

Application note

Texas Instruments Little Logic Application Report

Application note

Semiconductor Packing Material Electrostatic Discharge (ESD) Protection

Application note

Live Insertion

Application note

Dual Positive-Edge-Triggered D-Type Flip-Flop, SN74LVC2G79 datasheet (Rev. E)

Data sheet

16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)

Application note

TI IBIS File Creation, Validation, and Distribution Processes

Application note

Logic Guide (Rev. AB)

Selection guide

Design Summary for WCSP Little Logic (Rev. B)

Product overview

Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices

Application note

Little Logic Guide 2018 (Rev. G)

Selection guide

Understanding Advanced Bus-Interface Products Design Guide

Application note

Use of the CMOS Unbuffered Inverter in Oscillator Circuits

Application note

LOGIC Pocket Data Book (Rev. B)

User guide

CMOS Power Consumption and CPD Calculation (Rev. B)

Application note