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R6020ENZ4C13
Discrete Semiconductor Products

R6576ENZ4C13

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Rohm Semiconductor

650V 76A TO-247, LOW-NOISE POWER MOSFET

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R6020ENZ4C13
Discrete Semiconductor Products

R6576ENZ4C13

Active
Rohm Semiconductor

650V 76A TO-247, LOW-NOISE POWER MOSFET

Technical Specifications

Parameters and characteristics for this part

SpecificationR6576ENZ4C13
Current - Continuous Drain (Id) @ 25°C76 A
Drain to Source Voltage (Vdss)650 V
Drive Voltage (Max Rds On, Min Rds On)10 V
FET TypeN-Channel
Gate Charge (Qg) (Max) @ Vgs [Max]260 nC
Input Capacitance (Ciss) (Max) @ Vds6500 pF
Mounting TypeThrough Hole
Operating Temperature150 °C
Package / CaseTO-247-3
Power Dissipation (Max)735 W
Rds On (Max) @ Id, Vgs46 mOhm
Supplier Device PackageTO-247
TechnologyMOSFET (Metal Oxide)
Vgs (Max)20 V
Vgs(th) (Max) @ Id4 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyN/A 539$ 15.89
Tube 1$ 13.16
30$ 11.04

Description

General part information

R6576 Series

R6576ENZ4 is a power MOSFET for switching applications.

Documents

Technical documentation and resources

How to Create Symbols for PSpice Models

Models

R6576ENZ4 Data Sheet

Data Sheet

What Is Thermal Design

Thermal Design

MOSFET Gate Resistor Setting for Motor Driving

Technical Article

Example of Heat Dissipation Design for TO Packages: Effect of Heat Dissipation Materials

Thermal Design

Moisture Sensitivity Level - Transistors

Package Information

Part Explanation

Application Note

Calculation of Power Dissipation in Switching Circuit

Schematic Design & Verification

Overview of ROHM's Simulation Models(for ICs and Discrete Semiconductors)

Technical Article

Compliance of the RoHS directive

Environmental Data

TO247AD Explanation for Marking

Package Information

Types and Features of Transistors

Application Note

Judgment Criteria of Thermal Evaluation

Thermal Design

About Export Regulations

Export Information

Method for Calculating Junction Temperature from Transient Thermal Resistance Data

Thermal Design

How to Use the Thermal Resistance and Thermal Characteristics Parameters

Thermal Design

Notes for Temperature Measurement Using Thermocouples

Thermal Design

Anti-Whisker formation - Transistors

Package Information

Precautions When Measuring the Rear of the Package with a Thermocouple

Thermal Design

Report of SVHC under REACH Regulation

Environmental Data

Notes for Calculating Power Consumption:Static Operation

Thermal Design

PCB Layout Thermal Design Guide

Thermal Design

Two-Resistor Model for Thermal Simulation

Thermal Design

θ<sub>JC</sub> and Ψ<sub>JT</sub>

Thermal Design

Package Dimensions

Package Information

Basics of Thermal Resistance and Heat Dissipation

Thermal Design

How to Use LTspice&reg; Models

Schematic Design & Verification

Temperature derating method for Safe Operating Area (SOA)

Schematic Design & Verification

About Flammability of Materials

Environmental Data

MOSFET Gate Drive Current Setting for Motor Driving

Technical Article

List of Transistor Package Thermal Resistance

Thermal Design

Method for Monitoring Switching Waveform

Schematic Design & Verification

What is a Thermal Model? (Transistor)

Thermal Design

R6576ENZ4 ESD Data

Characteristics Data

Power Eco Family: Overview of ROHM's Power Semiconductor Lineup

White Paper

Importance of Probe Calibration When Measuring Power: Deskew

Schematic Design & Verification

Impedance Characteristics of Bypass Capacitor

Schematic Design & Verification

Measurement Method and Usage of Thermal Resistance RthJC

Thermal Design

Notes for Temperature Measurement Using Forward Voltage of PN Junction

Thermal Design

θ<sub>JA</sub> and Ψ<sub>JT</sub>

Thermal Design

How to Use LTspice&reg; Models: Tips for Improving Convergence

Schematic Design & Verification