Specification	BM23PF0.8-30DS-0.35V(51)

Connector Type	Receptacle, Center Strip Contacts
Contact Finish	Gold
Contact Finish Thickness	1.97 Áin
Contact Finish Thickness	0.05 Ám
Features	Solder Retention
Height Above Board [z]	0.8 mm
Height Above Board [z]	0.031 in
Mated Stacking Heights	0.8 mm
Mounting Type	Surface Mount
Number of Positions	30
Number of Rows [custom]	2
Pitch	0.014 in
Pitch	0.35 mm

BM23PF Series

Part	Height Above Board [z]	Height Above Board [z]	Mated Stacking Heights	Number of Positions	Contact Finish	Pitch	Pitch	Number of Rows [custom]	Contact Finish Thickness	Contact Finish Thickness	Mounting Type	Features	Connector Type
Hirose Electric Co Ltd BM23PF0.8-14DS-0.35V(895)	0.8 mm	0.031 in	0.8 mm	14	Gold	0.014 in	0.35 mm	2	1.97 Áin	0.05 Ám	Surface Mount	Solder Retention	Receptacle Center Strip Contacts
Hirose Electric Co Ltd BM23PF0.8-42DP-0.35V(51)	0.63 mm	0.025 in	0.8 mm	42	Gold	0.014 in	0.35 mm	2	1.97 Áin	0.05 Ám	Surface Mount	Solder Retention	Header Outer Shroud Contacts
Hirose Electric Co Ltd BM23PF0.8-40DS-0.35V(895)	0.8 mm	0.031 in	0.8 mm	40	Gold	0.014 in	0.35 mm	2	1.97 Áin	0.05 Ám	Surface Mount	Solder Retention	Receptacle Center Strip Contacts
Hirose Electric Co Ltd BM23PF0.8-30DS-0.35V(51)	0.8 mm	0.031 in	0.8 mm	30	Gold	0.014 in	0.35 mm	2	1.97 Áin	0.05 Ám	Surface Mount	Solder Retention	Receptacle Center Strip Contacts

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

General part information

BOARD TO BOARD & MEZZANINE CONNECTORS 30P RCPT STRGHT SMT HYBRID W/POWER

Technical documentation and resources