
LEOAC14PT-D
ActiveINVERTERS RAD-HARD PLASTIC HEX INVERTER WITH SCHMITT TRIGGER INPUT, NOT FLIGHT MODELS
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LEOAC14PT-D
ActiveINVERTERS RAD-HARD PLASTIC HEX INVERTER WITH SCHMITT TRIGGER INPUT, NOT FLIGHT MODELS
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Technical Specifications
Parameters and characteristics for this part
| Specification | LEOAC14PT-D |
|---|---|
| Current - Output High, Low [custom] | 24 mA |
| Current - Output High, Low [custom] | 24 mA |
| Current - Quiescent (Max) [Max] | 40 µA |
| Features | Schmitt Trigger Input |
| Grade | Automotive |
| Input Logic Level - High [Max] | 3.85 V |
| Input Logic Level - High [Min] | 2.1 V |
| Input Logic Level - Low [Max] | 1.65 V |
| Input Logic Level - Low [Min] | 0.9 V |
| Logic Type | Inverter |
| Max Propagation Delay @ V, Max CL | 12 ns |
| Mounting Type | Surface Mount |
| Number of Circuits | 6 |
| Number of Inputs | 6 |
| Operating Temperature [Max] | 125 °C |
| Operating Temperature [Min] | -40 C |
| Package / Case | 20-TSSOP |
| Package / Case [x] | 0.173 " |
| Package / Case [y] | 4.4 mm |
| Qualification | AEC-Q100 |
| Supplier Device Package | 20-TSSOP |
| Voltage - Supply [Max] | 6 V |
| Voltage - Supply [Min] | 2 V |
Pricing
Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly
Description
General part information
LEOAC14 Series
The LEOAC14 is a CMOS low power hex inverter qualified for use in aerospace environments. It operates from 1.65 V to 6 V power supply (7 V absolute maximum ratings). Each operator features a Schmitt trigger input that is capable of transforming slowly changing input signals into sharp output signals.
The LEOAC14 can operate over a large temperature range of -40 °C to +125 °C and it is housed in a plastic TSSOP-20, thin-shrink small outline package, 20 leads, using gold-wires and nickel/palladium/golden-lead-finishing to prevent whiskers.
The LEOAC14 is compliant with ST-LEO-specification, dedicated specification for space-ready rad-hard plastic products. This AEC-Q100-based specification offers a specific trade-off between footprint size savings, cost of ownership and quality assurance together with radiation hardness and large quantity capability.
Documents
Technical documentation and resources