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Integrated Circuits (ICs)

LM158J

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Texas Instruments

MILITARY-GRADE, DUAL, 32-V, 700-KHZ OP AMP

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CDIP (NAB)
Integrated Circuits (ICs)

LM158J

Active
Texas Instruments

MILITARY-GRADE, DUAL, 32-V, 700-KHZ OP AMP

Technical Specifications

Parameters and characteristics for this part

SpecificationLM158J
Amplifier TypeGeneral Purpose
Current - Input Bias40 nA
Current - Output / Channel [custom]40 mA
Current - Supply1 mA
Gain Bandwidth Product1 MHz
Mounting TypeThrough Hole
Number of Circuits2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Package / Case7.62 mm
Package / Case0.3 in
Package / Case8-CDIP
Supplier Device Package8-CDIP
Voltage - Input Offset2 mV
Voltage - Supply Span (Max) [Max]32 V
Voltage - Supply Span (Min) [Min]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyTube 1$ 18.59
10$ 13.45
25$ 12.13
100$ 10.65
250$ 9.94
500$ 9.54
NewarkEach 1$ 18.98
5$ 18.28
10$ 17.62
25$ 17.01
80$ 16.47
120$ 16.16
280$ 15.88
Texas InstrumentsTUBE 1$ 14.55
100$ 12.71
250$ 9.80
1000$ 8.76

Description

General part information

LM158-N Series

The LM158 series consists of two independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single power supply over a wide range of voltages. Operation from split power supplies is also possible and the low power supply current drain is independent of the magnitude of the power supply voltage.

Application areas include transducer amplifiers, DC gain blocks and all the conventional op-amp circuits which now can be more easily implemented in single power supply systems. For example, the LM158 series can be directly operated off of the standard 3.3-V power supply voltage which is used in digital systems and will easily provide the required interface electronics without requiring the additional ±15-V power supplies.

The LM358 and LM2904 are available in a chip-sized package (8-bump DSBGA) using TI’s DSBGA package technology.