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5962-7802301Q2A
Integrated Circuits (ICs)

5962-87710012A

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Texas Instruments

MILITARY-GRADE, DUAL, 30-V, 700-KHZ OPERATIONAL AMPLIFIER

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5962-7802301Q2A
Integrated Circuits (ICs)

5962-87710012A

Active
Texas Instruments

MILITARY-GRADE, DUAL, 30-V, 700-KHZ OPERATIONAL AMPLIFIER

Technical Specifications

Parameters and characteristics for this part

Specification5962-87710012A
Amplifier TypeGeneral Purpose
Current - Input Bias20 nA
Current - Output / Channel [custom]40 mA
Current - Supply500 ÁA
Gain Bandwidth Product700 kHz
GradeAutomotive
Mounting TypeSurface Mount
Number of Circuits2
Operating Temperature [Max]125 °C
Operating Temperature [Min]-55 °C
Package / Case20-CLCC
QualificationAEC-Q100
Slew Rate0.3 V/Ás
Supplier Device Package20-LCCC (8.89x8.89)
Voltage - Input Offset3 mV
Voltage - Supply Span (Max) [Max]36 V
Voltage - Supply Span (Min) [Min]3 V

Pricing

Prices provided here are for design reference only. For realtime values and availability, please visit the distributors directly

DistributorPackageQuantity$
DigikeyBulk 15$ 21.14
Texas InstrumentsTUBE 1$ 29.16
100$ 25.47
250$ 19.64
1000$ 17.56

Description

General part information

LM158-N Series

The LM158 series consists of two independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single power supply over a wide range of voltages. Operation from split power supplies is also possible and the low power supply current drain is independent of the magnitude of the power supply voltage.

Application areas include transducer amplifiers, DC gain blocks and all the conventional op-amp circuits which now can be more easily implemented in single power supply systems. For example, the LM158 series can be directly operated off of the standard 3.3-V power supply voltage which is used in digital systems and will easily provide the required interface electronics without requiring the additional ±15-V power supplies.

The LM358 and LM2904 are available in a chip-sized package (8-bump DSBGA) using TI’s DSBGA package technology.